A kind of high-order tangential enveloping grinding and polishing processing method and its application
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAZHONG UNIV OF SCI & TECH
- Publication Date
- 2020-07-10
Smart Images

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Abstract
Description
technical field
[0001] The invention belongs to the technical field of intelligent grinding and polishing, and more specifically relates to a high-order tangential contact enveloping grinding and polishing method and its application. Background technique
[0002] With the development of science and technology, complex surfaces are widely used in aerospace, automobile, ship and other fields. These surfaces cannot be composed of elementary analytical surfaces, and it is difficult to obtain accurate analytical solutions for free complex surfaces. Therefore, the finishing of complex surfaces is a manufacturing problem that needs to be solved urgently.
[0003] like figure 2 As shown, the first-order contact has a common tangent plane; the second-order contact has the same curvature; the third-order contact has the same curvature and curvature derivative. In the field of grinding processing, there is no contact order. Evaluation criteria Research on the planning of the tool pat...