Copper-based composite material and preparation method thereof

A copper-based composite material, mass percentage technology, applied in the field of metals and their composite materials, can solve the problems of high production cost, complicated preparation process, limited popularization and application, etc., and achieves the effect of short production cycle and simple process.

Active Publication Date: 2019-09-20
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation process is very complicated and the process is not easy to control. In addition, due to the ceramic phase TiC and La 2 o 3 And the melting point of the W phase is too far from that of the Cu phase. Incomplete or uneven remelting will seriously affect the material properties. At the same time, the high production cost will greatly limit its popularization and application.
In addition, the material does not have the function of nuclear radiation resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Select Cu powder (purity and particle size are 99.6% and 80nm respectively), W powder (purity and particle size are 99.6% and 80nm respectively) and B 4 C powder (purity and particle size are 99.6% and 80nm respectively) is used as the raw material, and the weight ratio is controlled at 77:18:5. Vacuum is 10 -1 Pa;

[0021] (2) Put the ball mill jar into the ball mill for ball milling, the ball milling time is 8 hours, take out the mixed powder and fill it into a mold made of heat-resistant steel;

[0022] (3) Put the mold into a vacuum hot-pressing sintering furnace for hot-pressing sintering molding. The sintering temperature is 1030°C, the heating rate is 50°C / min, the sintering pressure is 60MPa, the heat preservation and pressure holding time is 3h, and the vacuum degree is 10 -3 Pa, after the sintering is completed, the temperature of the furnace is lowered and cooled to obtain a copper-based composite material. Taking out the sintered body is Cu-W-B 4 C c...

Embodiment 2

[0024] The technical process is basically the same as in Example 1, but the process parameters are different.

[0025] (1) Cu powder particle size 70nm, W powder particle size 70nm, B 4 The particle size of C powder is 70nm, and the weight ratio is controlled at 96.5:3:0.5;

[0026] (2) Ball milling time 2h;

[0027] (3) The hot pressing sintering temperature is 950°C, the heating rate is 70°C / min, the sintering pressure is 50MPa, and the heat preservation and pressure holding time is 1h. The obtained copper matrix composite material has an electrical conductivity of 88.6% IACS and a density of 99.9%. , tensile strength 258MPa, hardness 58.3HBW.

Embodiment 3

[0029] The technical process is basically the same as in Example 1, but the process parameters are different.

[0030] (1) Cu powder particle size 60nm, W powder particle size 60nm, B 4 The particle size of C powder is 60nm, and the weight ratio is controlled at 90:8:2;

[0031] (2) Ball milling time 3.5h;

[0032] (3) The hot pressing sintering temperature is 980°C, the heating rate is 60°C / min, the sintering pressure is 55MPa, and the heat preservation and pressure holding time is 1.5h. The obtained copper matrix composite material has an electrical conductivity of 80.6% IACS and a density of 99.5 %, the tensile strength reaches 291MPa, and the hardness is 62.6HBW.

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Abstract

The invention relates to a copper-based composite material and a preparation method thereof, and belongs to the field of metal and composite materials thereof. The copper-based composite material comprises the following components of, in percentage by weight, 3%-18% of W, 0.5%-5% of B4C, and the balance copper. The preparation method comprises the following steps of firstly, selecting high-purity Cu powder, W powder and B4C powder, and weighing the Cu powder, the W powder and the B4C powder by adopting a high-precision balance, and carrying out vacuum ball milling for 2 h-8 h; secondly, filling the mixed powder into a mold made of heat-resistant steel, and then putting the mold into a vacuum hot-press sintering furnace for hot-pressing sintering forming, wherein the sintering temperature is 950 DEG C-1030 DEG C, the sintering pressure is 50 MPa-60 MPa, the heat and pressure preservation time is 1 h-3 h, and the vacuum degree is 10<-3> Pa; finally, carrying out cooling along with the furnace after the sintering is completed. The copper-based composite material preparation method has the advantage of being simple in process, and the prepared copper-based composite material has good comprehensive performance and can be used in strict working conditions of power receiving, abrasion, corrosion and nuclear radiation interaction, thus having a very wide application prospect and popularization value.

Description

technical field [0001] The invention belongs to the field of metals and composite materials thereof, and in particular relates to a copper-based composite material and a preparation method thereof. Background technique [0002] Metal copper (Cu) is one of the earliest metals used by humans. It has outstanding characteristics such as high thermal conductivity and electrical conductivity, good ductility, good corrosion resistance, and excellent formability, so it is widely used in cables and electrical and electronic components. , military armor-piercing weapons, electromagnetic gun tracks and other fields. However, with the rapid development of science and technology, the use of metal copper is becoming wider and wider, and the requirements for its use are getting higher and higher. A single metal copper has been difficult to meet the development needs of human beings. Under this background, various copper alloys or copper-based composite materials have emerged as the times ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C32/00C22C1/05
CPCB22F2998/10C22C1/05C22C9/00C22C32/0057B22F2009/043B22F3/14
Inventor 李秀青魏世忠杨晴霞张敏杰徐流杰周玉成陈冲毛丰潘昆明张程张国赏游龙刘伟
Owner HENAN UNIV OF SCI & TECH
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