Copper-based composite material and preparation method thereof
A copper-based composite material, mass percentage technology, applied in the field of metals and their composite materials, can solve the problems of high production cost, complicated preparation process, limited popularization and application, etc., and achieves the effect of short production cycle and simple process.
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Embodiment 1
[0020] (1) Select Cu powder (purity and particle size are 99.6% and 80nm respectively), W powder (purity and particle size are 99.6% and 80nm respectively) and B 4 C powder (purity and particle size are 99.6% and 80nm respectively) is used as the raw material, and the weight ratio is controlled at 77:18:5. Vacuum is 10 -1 Pa;
[0021] (2) Put the ball mill jar into the ball mill for ball milling, the ball milling time is 8 hours, take out the mixed powder and fill it into a mold made of heat-resistant steel;
[0022] (3) Put the mold into a vacuum hot-pressing sintering furnace for hot-pressing sintering molding. The sintering temperature is 1030°C, the heating rate is 50°C / min, the sintering pressure is 60MPa, the heat preservation and pressure holding time is 3h, and the vacuum degree is 10 -3 Pa, after the sintering is completed, the temperature of the furnace is lowered and cooled to obtain a copper-based composite material. Taking out the sintered body is Cu-W-B 4 C c...
Embodiment 2
[0024] The technical process is basically the same as in Example 1, but the process parameters are different.
[0025] (1) Cu powder particle size 70nm, W powder particle size 70nm, B 4 The particle size of C powder is 70nm, and the weight ratio is controlled at 96.5:3:0.5;
[0026] (2) Ball milling time 2h;
[0027] (3) The hot pressing sintering temperature is 950°C, the heating rate is 70°C / min, the sintering pressure is 50MPa, and the heat preservation and pressure holding time is 1h. The obtained copper matrix composite material has an electrical conductivity of 88.6% IACS and a density of 99.9%. , tensile strength 258MPa, hardness 58.3HBW.
Embodiment 3
[0029] The technical process is basically the same as in Example 1, but the process parameters are different.
[0030] (1) Cu powder particle size 60nm, W powder particle size 60nm, B 4 The particle size of C powder is 60nm, and the weight ratio is controlled at 90:8:2;
[0031] (2) Ball milling time 3.5h;
[0032] (3) The hot pressing sintering temperature is 980°C, the heating rate is 60°C / min, the sintering pressure is 55MPa, and the heat preservation and pressure holding time is 1.5h. The obtained copper matrix composite material has an electrical conductivity of 80.6% IACS and a density of 99.5 %, the tensile strength reaches 291MPa, and the hardness is 62.6HBW.
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