Transfer substrate, transfer method of light-emitting diode and transfer equipment

Abstract

The invention discloses a transfer substrate, a transfer method of a light-emitting diode and transfer equipment. The transfer substrate comprises a substrate, a reflecting layer, an optical conversion layer and a light-sensitive visbreaking film, wherein the reflecting layer is arranged at one side of the substrate, the optical conversion layer is arranged at one side, deviating from the substrate, of the reflecting layer, the light-sensitive visbreaking film is arranged at one side, deviating from the reflecting layer, of the optical conversion layer, the optical conversion layer is used for converting a light ray within a certain wavelength range to non-visible light, the light-sensitive visbreaking film is used for pasting the light-emitting diode, and the viscosity is reduced to relieve the light-emitting diode after irradiation of the non-visible light. By the transfer substrate, the transferring and the detection of the light-emitting diode can be simultaneously completed, the light-emitting diode with abnormal in light emitting is found out and transferred before a binding process, the problems that the light-emitting diode with abnormal light emitting is difficult to take out and the array substrate is damaged by a laser cutting process are prevented, the transfer process flow is simplified, and the transfer yield and efficiency is improved; and moreover, a light source of the non-visible light is not needed to be additionally arranged, and the transfer substrate is simple in structure and relatively low in detection cost.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method and equipment for transferring substrates and light-emitting diodes. Background technique [0002] With the development of light emitting diode (Light Emitting Diode, LED), micro light emitting diode (Micro-LED) display technology has become one of the hotspots of future display technology. control, high luminance, low power consumption, ultra-high resolution and high chromaticity, etc., but there are many technical difficulties in Micro-LED display technology, especially the mass transfer technology. [0003] The process of transferring Micro-LEDs is generally as follows: transfer Micro-LEDs to the array substrate, bind the electrodes of Micro-LEDs to the array substrate, control the light emission of Micro-LEDs for lighting detection, and use The laser cuts off the electrical connection between the electrode of the Micro-LED and the array substrate, thereby removing ...

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Problems solved by technology

[0005] Embodiments of the present invention provide a transfer substrate, a transfer method for light-emitting diodes, and transfer equipment to solve the problem in the prior art that during the transfer process of Micro-LEDs, it is difficult to remove the abnormally luminous Micro-LEDs, and the use of laser The problem that cutting is easy to damage the array substrate

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