Hub type blade and manufacturing method of hub type blade

A manufacturing method and hub-type technology, which is applied in manufacturing tools, semiconductor/solid-state device manufacturing, bonded grinding wheels, etc., can solve the problems of expansion difference between the aluminum base metal and the blade body, long time, and cost, and achieve resource saving and reduction Manufacturing cost, effect of suppressing deformation or warpage

Active Publication Date: 2020-09-18
TOKYO SEIMITSU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Fourth: When performing alkaline etching on the aluminum base metal, it needs to be immersed in an alkaline solution at about 80°C, which may further cause a difference in expansion and cause peeling of the aluminum base metal and the blade body
In addition, alkaline etching takes a very long time

Method used

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  • Hub type blade and manufacturing method of hub type blade
  • Hub type blade and manufacturing method of hub type blade
  • Hub type blade and manufacturing method of hub type blade

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0149] Below, refer to Figure 1 ~ Figure 3 , the hub blade according to the first embodiment of the present invention will be described.

[0150] figure 1 It is a perspective view explaining an example of the schematic structure of the hub type insert concerning 1st Embodiment of this invention, figure 2 is in figure 1 In the cross-sectional view indicated by arrow II-II, image 3 is an enlarged partial cross-sectional view.

[0151] exist Figure 1 ~ Figure 3 Among them, reference numeral 100 denotes a hub-type blade, reference numeral 110 denotes a hub, reference numeral 120 denotes a double-sided adhesive tape, and reference numeral 130 denotes a blade body.

[0152] Such as figure 1 As shown, the hub blade 100 includes, for example, a hub 110, a double-sided adhesive tape 120, and a blade body 130, and is capable of dicing a wafer (substrate such as a semiconductor material) and singulating it into IC chips (chip shape).

[0153] Such as Figure 1 ~ Figure 3 A...

no. 2 approach

[0273] Below, refer to Figure 10 and Figure 11 , the hub blade according to the second embodiment of the present invention will be described.

[0274] Figure 10 It is a perspective view illustrating an example of a schematic structure of a hub blade according to a second embodiment of the present invention, and is in figure 1 The cross-sectional view indicated by the arrow X-X. in addition, Figure 11 is in Figure 10 Enlarged view of the portion indicated by XI in .

[0275] exist Figure 10 and Figure 11 In , reference numeral 200 denotes a hub-type blade, reference numeral 110 denotes a hub, reference numeral 220 denotes a double-sided adhesive tape, and reference numeral 130 denotes a blade body.

[0276] Such as Figure 10 As shown, the hub blade 200 includes, for example, a hub 110 , a double-sided adhesive tape (adhesive connection portion) 220 , and a blade body 130 .

[0277] Since the hub 110 and the blade main body 130 are the same as those in the fir...

no. 3 approach

[0295] Below, refer to figure 1 , Figure 12 ~ Figure 13 , the hub blade according to the third embodiment of the present invention will be described.

[0296] Figure 12 yes figure 1 The cross-sectional view indicated by the arrow XII-XII in the middle, Figure 13 is an enlarged partial cross-sectional view.

[0297] In the drawings, reference numeral 300 denotes a hub-type blade, reference numeral 310 denotes a hub, reference numeral 320 denotes an adhesive resin portion (adhesive, connecting portion), and reference numeral 330 denotes a blade main body.

[0298] Such as figure 1 , Figure 12 and Figure 13 As shown, the hub blade 300 includes, for example, a hub 310, an adhesive resin portion (adhesive joint, connecting portion) 320, and a blade body 330, and is capable of dicing a wafer (substrate such as a semiconductor material) and singulating it into IC chips or the like.

[0299] Such as figure 1 , Figure 12 and Figure 13 As shown, the hub 310 include...

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Abstract

A hub-type blade that rotates around an axis (O1), characterized in that it comprises: a hub (110) constructed of an aluminum alloy and formed with a blade mounting surface (111A); a blade body (130) configured on the blade On the mounting surface (111A) and in the metal parent material constructed by nickel or nickel alloy, diamond superabrasive grains are dispersed; and a double-sided adhesive tape (120), is configured between the hub (110) and the blade main body ( 130), for connecting the hub (110) and the blade main body (130).

Description

technical field [0001] The present invention relates to a hub blade for cutting substrates such as semiconductor materials into individual chips and a method for manufacturing the hub blade. [0002] This application applies to Japanese Patent Application No. 2017-024400, Japanese Patent Application No. 2017-024401, Japanese Patent Application No. 2017-024402, Japanese Patent Application No. 2017-024403, and Japanese Patent Application No. 2017-024404 filed in Japan on February 13, 2017. Priority is claimed in Japanese Patent Application No. 2017-138504 filed in Japan on July 14, and its content is hereby cited. Background technique [0003] It is well known that when a substrate such as a semiconductor material is cut into individual chips, a blade formed in a circular shape is used, and as one means of stabilizing the rotation of the blade, a hub-type blade (such as , refer to Patent Document 1). [0004] Such as Figure 30 As shown, the structure of the hub blade 100 in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D5/12B24B45/00B28D5/02H01L21/301
CPCB24B45/00B24D5/12B28D5/02
Inventor 星纯二冢本早纪山中纪幸
Owner TOKYO SEIMITSU
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