Addition-curable silicone composition, cured silicone and optical semiconductor device

A technology of optical semiconductor devices and silicone compositions, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor light transmission, achieve good crack resistance, excellent transparency and heat discoloration resistance, and hardness changes and weight reduction effect

Inactive Publication Date: 2019-10-01
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this heat-resistant silicone rubber composition, there is a problem that the light transmittance of short-wavelength light around a wavelength of 400 nm is poor.

Method used

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  • Addition-curable silicone composition, cured silicone and optical semiconductor device
  • Addition-curable silicone composition, cured silicone and optical semiconductor device
  • Addition-curable silicone composition, cured silicone and optical semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0111] Hereinafter, the present invention will be specifically described using synthesis examples, examples, and comparative examples, but the present invention is not limited thereto.

[0112] In the following examples, the symbols indicating the composition of silicone oil or silicone resin are as follows.

[0113] M: (CH 3 ) 3 SiO 1 / 2

[0114] m Vi :(CH 2 =CH)(CH 3 ) 2 SiO 1 / 2

[0115] D. H :(CH 3 )HSiO 2 / 2

[0116] D:(CH 3 ) 2 SiO 2 / 2

[0117] D. Vi :(CH 2 =CH)(CH 3 ) SiO 2 / 2

Synthetic example 1

[0119] (D) Preparation of ingredients

[0120] 10 parts by mass (the amount of cerium is 0.55 parts) of turpentine oil solution (rare earth element content is 6 mass %) and 2.1 mass parts of n-butyl tetratitanate ( The mass of titanium is 0.3 times the mass of cerium in the 2-ethylhexanoate), and the mixture is fully stirred and added to 100 parts by mass of trimethylsiloxy-terminated trimethylsiloxy at both ends with a viscosity of 100 mPa·s. In dimethylpolysiloxane, a yellow-white dispersion liquid was obtained. A small amount of nitrogen gas was passed through it while heating to make the turpentine flow out, and then heated at 300° C. for 1 hour to obtain a thick reddish-brown transparent polyorganometallic siloxane.

Embodiment 1～5、 comparative example 1～5

[0122] The following components were blended in the blending amounts (unit: parts by mass) shown in Table 1 to obtain an addition-curable silicone composition.

[0123] (A-1) Average composition formula M Vi 2 D. 445 D. Vi 4.5 (Vinyl: 0.19 mmol / g) organopolysiloxane with a viscosity of 5.0 Pa·s

[0124] (A-2) Average composition formula M 2 D. 550 D. Vi 5.5 Organopolysiloxane represented by (vinyl: 0.13 mmol / g) with a viscosity of 10.0 Pa·s

[0125] (A-3) Average composition formula M Vi 2 D. 440 D. Vi 9 (Vinyl: 0.33 mmol / g) organopolysiloxane with a viscosity of 5.0 Pa·s

[0126] (A-4) Average composition formula M Vi 2 D. 450 (Vinyl: 0.06 mmol / g) organopolysiloxane with a viscosity of 5.0 Pa·s

[0127] (A-5) Average composition formula M Vi 2 D. 405 D. Vi 45 Organopolysiloxane represented by (vinyl: 1.38 mmol / g) with a viscosity of 5.0 Pa·s

[0128] (A-6) Average composition formula M Vi 2 D. 550 D. Vi 1 (Vinyl: 0.07 mmol / g) organopolysiloxane wi...

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Abstract

The present invention provides an addition-curable silicone composition generating a cured product. The cured product has a small change in hardness and a small decrease in weight under high temperature conditions, and does not leak oil even when exposed to near ultraviolet to violet light in a high temperature and high humidity environment. The composition contains the following components and iscured by heating: (A) a straight-chain organopolysiloxane having at least 2 alkenyl groups in each molecule and represented by the following average composition formula (1) that is (R<3><1>SiO<1/2>)a(R<2><1>R2SiO<1/2)b(R<2><1>SiO)c(R1R2SiO)d; (B) organohydrogenpolysiloxane which has, in each molecule, at least two hydrogen atoms bonds with silicon atoms, and which does not have a carbon-carbon double bond capable of addition reactions; (C) a hydrosilylation catalyst containing a platinum group metal; and (D) polyorganometallosiloxane having a Si-O-Ce bond and a Si-O-Ti bond.

Description

technical field [0001] The present invention relates to an addition-curable silicone composition, its cured product, and an optical semiconductor device using the cured product as a sealing material. Background technique [0002] Epoxy resins are generally used as sealing materials for LED elements, but Patent Documents 1 to 3 propose using silicone resins as sealing materials instead of epoxy resins. Compared with epoxy resins, silicone resins are superior in heat resistance, weather resistance, and discoloration resistance, so they are mainly used for blue LEDs and white LEDs. [0003] However, as the amount of electricity to LEDs has increased in recent years, the temperature near the LED elements has risen, and even when silicone resins are used, there have been problems of deterioration of the sealing material, cracks, and a drop in light transmittance due to discoloration. [0004] Furthermore, the use of high-output short-wavelength LED elements has increased, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/08H01L33/56C09J183/04C09J183/05C09J183/08
CPCC08L83/04H01L33/56C09J183/04C08L2203/206C08L2201/08C08L2205/025C08L2205/02C08L2205/03C08G77/20C08G77/22C08G77/12C08L83/08C08G77/398C08L83/14
Inventor 木村真司
Owner SHIN ETSU CHEM IND CO LTD
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