Electric-magnetic field synergetic enhancement high-power pulse magnetron sputtering deposition device and method

Abstract

The invention discloses an electric-magnetic field synergetic enhancement high-power pulse magnetron sputtering deposition device and method, and belongs to the technical field of coating. In order tosolve the problems that according to an existing high-power pulse magnetron sputtering method, the electron utilization rate is low, the deposition rate during coating is low, and system particle ionization rate remains to be further increased, according to the deposition device, an excitation coil is wound around the outer side of a cathode magnetic control target, a direct current and constantcurrent power source supplies continuous and adjustable current to the excitation coil at the outer side of the cathode magnetic control target, an auxiliary anode is placed into a vacuum chamber, anda direct current and constant voltage power source supplies continuous and adjustable voltage to the auxiliary anode inside the vacuum chamber; according to the deposition method of the deposition device, the coaxial excitation coil is used for optimizing distribution of a magnetic field in front of the cathode magnetic control target, meanwhile, the auxiliary anode is used for controlling distribution of an electric field / potential inside the vacuum chamber, directional electron pulling and restraining can be achieved, then, the purposes of improving the electron utilizing rate of the high-power pulse magnetron sputtering technology and the deposition rate and further increasing the system particle ionization rate can be achieved, and a high-quality coating is deposited. The electric-magnetic field synergetic enhancement high-power pulse magnetron sputtering deposition device and method can be used for the technical field of coatings.

Description

technical field

[0001] The invention belongs to the technical field of coating, and in particular relates to an electric-magnetic field synergistically enhanced high-power pulse magnetron sputtering deposition device and method. Background technique

[0002] Physical vapor deposition technology is a common technology for preparing hard coatings. It has the advantages of low deposition temperature (200 ° C), wide application range of substrates, and easy control of film quality. The representative one is magnetron sputtering. Radiation technology and multi-arc ion plating technology. Magnetron sputtering technology has the advantages of high deposition rate, but its sputtering metal ionization rate is low and has the disadvantages of non-dense film layer and poor film / substrate bonding strength; while multi-arc ion plating technology although metal ionization rate Higher, but there is often the problem of "big particles", which leads to the deterioration of the surface quali...

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