Turret-type die bonder

A crystal-bonding machine and turret-type technology, which is applied in the direction of conveyor objects, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of high price, restricting the development of small and medium-sized enterprises, repeated positioning material rate and reliability to be improved, etc. , to achieve the effect of high reliability manufacturing process requirements and low manufacturing cost

Pending Publication Date: 2019-10-01
NORTECH AUTOMATION SHENZHEN CO LTD
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AI Technical Summary

Problems solved by technology

However, the equipment imported from abroad is expensive, and domestic die-bonding machine equipment needs to be improved not only in terms of die-bonding speed, but also in terms of repeatability and reliability.
The initial investment in small and medium-sized enterprises is large, which seriously restricts the development of small and medium-sized enterprises

Method used

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  • Turret-type die bonder
  • Turret-type die bonder
  • Turret-type die bonder

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Embodiment Construction

[0045] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific embodiments.

[0046]As an embodiment, the present invention proposes a turret-type crystal bonding machine, including a correction compensation system, a crystal extraction system, a glue dispensing system, a crystal bonding system, a turret system, and a detection system;

[0047] Wherein, the correction compensation system is used for fine-tuning the position of the chip on the wafer on which the chip is loaded;

[0048] The crystal picking system is used to pick up the chips on the wafer;

[0049] The glue dispensing system is used to dispens glue on the lead frame where the chip is placed after the crystal is taken;

[0050] The crystal-bonding system is used for performing a crystal-bonding operation on the chip on the lead frame after dispensing;

[00...

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PUM

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Abstract

The invention discloses a turret-type die bonder, which relates to the field of chip manufacturing. The turret-type die bonder includes a correction and compensation system, a die picking system, a dispensing system, a die bonding system, a turret system and a detection system. The correction and compensation system is used for finely adjusting the position of a chip on a wafer disc loaded with achip. The die picking system is used for picking up the chip on the wafer disc. The dispensing system is used for dispensing a lead frame. The die bonding system is used for bonding the chip and the lead frame. The turret system transfers the chip, which passes through the die picking system, the dispensing system and the die bonding system in turn. The detection system is used for position parameter compensation and correction before chip picking and before die bonding. By adopting the combination of a set of turret-type multi-swing-arm suction nozzle system and three sets of voice coil motorpressing mechanisms as well as a high-speed computer operation control system and a high-speed industrial camera video processing system, the processes of continuous die picking from the wafer disc,dispensing and die bonding are realized.

Description

technical field [0001] The invention relates to the field of chip manufacturing, in particular to a turret-type crystal bonder. Background technique [0002] With the development of semiconductor chips and the country's strong support for the semiconductor industry, the market's demand for semiconductor chip packaging equipment is increasing. The precision, speed and reliability of the equipment are getting higher and higher. However, the equipment imported from abroad is expensive, and the domestic die bonder equipment needs to be improved not only in the die bonding speed, but also in the repositioning rate and reliability. The initial investment in small and medium-sized enterprises is large, which seriously restricts the development of small and medium-sized enterprises. Contents of the invention [0003] According to the deficiencies of the prior art above, the technical problem to be solved by the present invention is to propose a turret-type crystal bonder, which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683H01L21/687H01L33/48
CPCH01L21/67092H01L21/67144H01L21/67259H01L21/67276H01L21/67742H01L21/6838H01L21/68742H01L33/48
Inventor 李辉王体李俊强
Owner NORTECH AUTOMATION SHENZHEN CO LTD
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