Device and method used for cutting brittle materials by multiple laser focuses and capable of producing dynamically adjustable optical field

Abstract

The invention discloses a device and a method used for cutting brittle materials by multiple laser focuses and capable of producing a dynamically adjustable optical field, and relates to the technicalfield of brittle material cutting. The device comprises multiple laser branch circuits, each laser branch circuit comprises a laser, each laser is connected with an optical fiber coupler through an optical fiber, a beam expander is arranged behind each optical fiber coupler, and a focusing mirror is arranged behind each beam expander. The device further comprises beam splitter prisms, and the beam splitter prisms are used reversely for combining the focused laser beams in a plurality of the laser branch circuits so as to generate the multiple laser focuses on the same optical axis to cut materials to be cut and separated. Through precise control of the number, the positions and the power density of the laser focuses, the dynamic laser field matched with the structure of the cut and separated materials is always generated within the materials, and thus laser separation of the brittle materials with the complex structure is completed.

Description

technical field [0001] The invention relates to the technical field of brittle material cutting, in particular to a multi-laser focal point cutting brittle material device and method with dynamically adjustable light field. Background technique [0002] At present, the cutting and separation of brittle materials such as glass, quartz, ceramics, crystals, and silicon is still dominated by mechanical cutting and separation, which faces problems such as low cutting efficiency, poor cutting quality, need for subsequent grinding and polishing, and cumbersome process flow. The traditional laser cutting method can only realize the cutting of materials with the same thickness. Although the separation of planar materials can be achieved, when cutting and separating materials with complex structures such as curved glass materials, it is impossible to produce materials that match the surface / structure of the cutting and separating materials. Due to the insufficient laser light field, t...

AI Technical Summary

Problems solved by technology

However, the traditional laser separation method has only one laser focus, so it cannot generate a dynamic laser light field that matches the material structure, so it cannot generate thermal tensile stress exceeding the threshold value of the tensile strength of the material, resulting in the failure of cutting and separation.

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