Method for preparing heating non-burning smoking set ceramic substrate rare earth thick film heating sheet
A heat-not-burn, ceramic substrate technology, used in ohmic resistance heating, ohmic resistance heating parts, tobacco, etc., can solve the problems of easy explosion, high risk factor, high production cost, easy operation and high safety factor , the effect of improving consistency
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Embodiment 1
[0052] S1, choose alumina with a thickness of 0.4mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;
[0053] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 15 μm, and then print the connecting circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 600°C Insulation for 40min for infiltration;
[0054] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 25 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then burnt infiltration to form a rare earth Thick film electrodes;
[0055] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, and for...
Embodiment 2
[0065] S1, choose alumina with a thickness of 0.3mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;
[0066] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 10 μm, and then print the connection circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 500°C Insulation for 10 minutes for infiltration;
[0067] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 10 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then burnt infiltration to form a rare earth Thick film electrodes;
[0068] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, an...
Embodiment 3
[0070] S1, choose alumina with a thickness of 0.5mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;
[0071] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 20 μm, and then print the connecting circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 700°C Insulation for 80min for infiltration;
[0072] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 40 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then infiltrated to form a rare earth Thick film electrodes;
[0073] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, and forming a ...
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