Method for preparing heating non-burning smoking set ceramic substrate rare earth thick film heating sheet

A heat-not-burn, ceramic substrate technology, used in ohmic resistance heating, ohmic resistance heating parts, tobacco, etc., can solve the problems of easy explosion, high risk factor, high production cost, easy operation and high safety factor , the effect of improving consistency

Inactive Publication Date: 2019-10-08
深圳市福来科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the MCH co-fired ceramic heating substrate disclosed above and its preparation method need to be sintered under the protection of a hydrogen atmosp

Method used

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  • Method for preparing heating non-burning smoking set ceramic substrate rare earth thick film heating sheet
  • Method for preparing heating non-burning smoking set ceramic substrate rare earth thick film heating sheet
  • Method for preparing heating non-burning smoking set ceramic substrate rare earth thick film heating sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] S1, choose alumina with a thickness of 0.4mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;

[0053] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 15 μm, and then print the connecting circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 600°C Insulation for 40min for infiltration;

[0054] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 25 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then burnt infiltration to form a rare earth Thick film electrodes;

[0055] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, and for...

Embodiment 2

[0065] S1, choose alumina with a thickness of 0.3mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;

[0066] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 10 μm, and then print the connection circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 500°C Insulation for 10 minutes for infiltration;

[0067] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 10 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then burnt infiltration to form a rare earth Thick film electrodes;

[0068] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, an...

Embodiment 3

[0070] S1, choose alumina with a thickness of 0.5mm as the ceramic substrate, and reserve two through holes on the ceramic substrate;

[0071] S2, clean the ceramic substrate, and then fill the through holes with solderable silver paste with a silver content greater than 80% and a thickness of 20 μm, and then print the connecting circuit on the front and back sides of the ceramic substrate, and then heat it at a high temperature of 700°C Insulation for 80min for infiltration;

[0072] S3, using rare earth thick film paste to print rare earth thick film circuits on both sides of the ceramic substrate, the printing thickness is 40 μm, so that the welding part of the rare earth thick film circuit and the connecting circuit is located in the through hole, and then infiltrated to form a rare earth Thick film electrodes;

[0073] S4, printing a protective layer, printing glass glaze on the rare earth thick film circuits on the front and back of the ceramic substrate, and forming a ...

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Abstract

The invention discloses a method for preparing a heating non-burning smoking set ceramic substrate rare earth thick film heating sheet. The method comprises steps that S1, two through holes are arranged in a ceramic substrate; S2, the through holes are filled with electrode slurry, and connection circuits are printed on front and back sides of the ceramic substrate; S3, rare earth thick film circuits are printed on the front and back sides of the ceramic substrate; and S4, a protective layer is printed. The method is advantaged in that processing steps are simple, operation is simple, in the smoking set technology field, defects of high production cost, high risk factor and easy explosion of traditional MCH ceramic heating bodies are overcome, the rare earth thick film material is appliedto the smoking set field to produce the heating sheet, production cost is greatly reduced, non-easy damage, high safety factor and easy wide promotion are achieved, rare earth thick film electrodes are printed on both sides of the ceramic substrate, resistance of the heating sheet can be reduced, the heat generation rate is improved, and consistency of the heating temperature on the front and backsides of the heating sheet is improved.

Description

technical field [0001] The invention relates to the technical field of smoking utensils, in particular to a method for manufacturing a heating sheet of a ceramic base material of a heat-not-burn smoking utensil. Background technique [0002] Cigarettes are a kind of tobacco products. Many people like to smoke cigarettes to relieve stress and refresh themselves. Regular smoking of cigarettes will lead to addiction. Tobacco will produce tar, nicotine, carbon monoxide, etc. when burned. Harmful, and the harm of second-hand smoke is greater than that of first-hand smoke, so many public places will have smoking ban measures, and when smoking tobacco will produce open flames, which can easily cause fires, so people have created a heat-not-burn smoke, heat-not-burn smoke It can meet the needs of smokers, and can reduce the content of tar and nicotine, so it is sought after by smokers. [0003] However, most of the existing heat-not-burn cigarettes are heated by resistance heating....

Claims

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Application Information

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IPC IPC(8): H05B3/02H05B3/03H05B3/22A24F47/00
CPCA24F47/008H05B3/02H05B3/03H05B3/22
Inventor 晏名勇
Owner 深圳市福来科技有限公司
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