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Glass ceramic, low temperature co-fired ceramic material with high bending strength, and preparation method of ceramic material

A technology of low-temperature co-fired ceramics and glass-ceramics, applied in the field of low-temperature co-fired ceramics, can solve problems such as poor flexural strength, and achieve the effects of good microwave electrical properties, improved impact resistance, and high flexural strength

Inactive Publication Date: 2019-10-22
CHENGDU HONGMING & UESTC NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a low-temperature co-fired ceramic material with high flexural strength, which is used to solve the technical problem of extremely poor flexural strength in the application process of low-temperature co-fired ceramics in the prior art

Method used

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  • Glass ceramic, low temperature co-fired ceramic material with high bending strength, and preparation method of ceramic material
  • Glass ceramic, low temperature co-fired ceramic material with high bending strength, and preparation method of ceramic material
  • Glass ceramic, low temperature co-fired ceramic material with high bending strength, and preparation method of ceramic material

Examples

Experimental program
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Effect test

Embodiment 1

[0041] A low-temperature co-fired ceramic material with high flexural strength, comprising the following components, calculated by weight percentage:

[0042] Glass-ceramic 40%; Aluminum oxide 60%;

[0043] The glass-ceramic includes the following components, calculated by weight percentage:

[0044] Calcium Carbonate 5%; Boric Acid 40%; Magnesium Carbonate 10%;

[0045] Cobalt oxide 15%; Zinc oxide 15%; Silicon oxide 15%.

[0046] A method for preparing a low-temperature co-fired ceramic material with high flexural strength: comprising the following steps:

[0047] S1: Preparation of glass powder

[0048] Take raw materials according to parts by weight: calcium carbonate 5%; boric acid 40%; magnesium carbonate 10%; cobalt oxide 15%; zinc oxide 15%; silicon oxide 15%; The temperature of the crucible is 1350°C, and continue to heat the crucible to 1450°C and melt for 60 minutes, then pour deionized water to quench to obtain glass slag, and perform airflow grinding on the gl...

Embodiment 2

[0052] A low-temperature co-fired ceramic material with high flexural strength, comprising the following components, calculated by weight percentage:

[0053] Glass-ceramic 45%; Aluminum oxide 55%;

[0054] The glass-ceramic includes the following components, calculated by weight percentage:

[0055] Calcium Carbonate 40%; Boric Acid 5%; Magnesium Carbonate 1%;

[0056] Cobalt oxide 1%; Zinc oxide 20%; Silicon oxide 33%.

[0057] A method for preparing a low-temperature co-fired ceramic material with high flexural strength: comprising the following steps:

[0058] S1: Preparation of glass powder

[0059] Raw materials are weighed according to parts by weight: calcium carbonate 40%; boric acid 5%; magnesium carbonate 1%; cobalt oxide 1%; zinc oxide 20%; silicon oxide 33%; The temperature of the crucible is 1350°C, and continue to heat the crucible to 1450°C and melt for 60 minutes, then pour deionized water to quench to obtain glass slag, and perform airflow grinding on the g...

Embodiment 3

[0063] A low-temperature co-fired ceramic material with high flexural strength, comprising the following components, calculated by weight percentage:

[0064] Glass-ceramic 45%; Aluminum oxide 55%;

[0065] The glass-ceramic includes the following components, calculated by weight percentage:

[0066] Calcium Carbonate 21%; Boric Acid 22%; Magnesium Carbonate 5%;

[0067] Cobalt oxide 11%; Zinc oxide 8%; Silicon oxide 33%.

[0068] A method for preparing a low-temperature co-fired ceramic material with high flexural strength: comprising the following steps:

[0069] S1: Preparation of glass powder

[0070] Raw materials are weighed according to parts by weight: calcium carbonate 21%; boric acid 22%; magnesium carbonate 5%; cobalt oxide 11%; zinc oxide 8%; silicon oxide 33%; The temperature of the crucible is 1350°C, and continue to heat the crucible to 1450°C and melt for 60 minutes, then pour deionized water to quench to obtain glass slag, and perform airflow grinding on t...

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Abstract

The invention discloses a low temperature co-fired ceramic material with a high bending strength. The material comprises 40-50 wt% of a glass ceramic and 50-60 wt% of alumina; and the glass ceramic comprises 5-40 wt% of calcium carbonate, 5-40 wt% of boric acid, 1-10 wt% of magnesium carbonate, 1-15 wt% of zirconium oxide, 5-20 wt% of zinc oxide and 15-50 wt% of silicon oxide. The calcium carbonate, boric acid, magnesium carbonate, zirconium oxide, zinc oxide and silicon oxide synergistically promote each other to produce the glass ceramic with a high viscosity. The low temperature co-fired ceramic material is prepared by melting the glass ceramic and alumina. The material can be sintered at 860 DEG C for 15 min to obtain the best density, and the obtained ceramic material has a bending strength of above 350 MPa, and can effectively improve the impact resistance of elements; and the ceramic material also has good microwave electrical properties, and the dielectric constant is about 8.0and the dielectric loss is less than 0.005 at 1.9 GHz and 15 GHz.

Description

technical field [0001] The invention relates to the technical field of low-temperature co-fired ceramics, specifically, a high-bending-strength low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] Low-temperature co-fired ceramics (LTCC) use low-temperature sintered ceramics and organic binders / plasticizers to mix in a certain proportion, and form green tapes by casting, punching holes, metallized wiring, and through-hole filling on the green tapes. Operation Finally, a multilayer wiring substrate made by low-temperature sintering is obtained. [0003] Low-temperature co-fired ceramic materials are widely used in various fields because of their good electrical insulation, high mechanical strength, heat resistance and corrosion resistance, such as DIP, LCCC, PGA, QFP , BGA, CSP, MCM, SiP and other packaging products, it can also be used for computer motherboards, high-speed circuit substrates, power circuit substrates, aut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622C03C10/00C03C12/00C03C6/04
CPCC04B35/10C04B35/622C03C10/00C03C12/00C03C1/00C04B2235/36C04B2235/656C04B2235/6567C04B2235/96C04B2235/9607
Inventor 李在映田茂林鄢健乔峰林晓云
Owner CHENGDU HONGMING & UESTC NEW MATERIALS