Three-dimensional buckling-structure flexible neural electrode and preparation process thereof

Abstract

The invention provides a three-dimensional buckling-structure flexible neural electrode and a preparation process thereof. The electrode comprises an elastic substrate, an adhesion layer, a polyimidesubstrate layer, a metal electrode layer and a polyimide packaging layer, the metal electrode layer is arranged on one surface of the polyimide substrate layer, the polyimide packaging layer is arranged above the metal electrode layer, and the polyimide substrate layer, the metal electrode layer and the polyimide packaging layer form a two-dimensional planar-structure electrode; the adhesion layeris arranged on the other surface of the polyimide substrate layer and comprises a Ti layer and a SiO2 layer, the Ti layer is arranged on the surface of the polyimide substrate layer, the SiO2 layer is arranged on the Ti layer, strong chemical bonds generated by condensation reaction between the SiO2 layer and the elastic substrate enable the two-dimensional planar-structure electrode to be bondedwith the surface of the elastic substrate, and the elastic substrate deforms to enable the two-dimensional planar-structure electrode to form the three-dimensional buckling-structure electrode underextruding effect.

Description

technical field [0001] The invention relates to a microelectrode in the technical field of biomedical engineering, in particular to a flexible neural electrode with a three-dimensional buckling structure and a preparation process thereof. Background technique [0002] Brain diseases have become one of the biggest challenges facing the health field in my country and the world. Most brain diseases, such as Parkinson's disease and Alzheimer's disease, lack clear mechanism research and effective treatment methods. Therefore, new technologies for brain diseases and The development of new treatment options is imminent. The excitation and conduction of neurons will cause the cerebral cortex to have continuous rhythmic potential changes, that is, the spontaneous brain electrical activity of the cortex, and the patterns of such bioelectrical activities can be recorded through electrodes and instruments. [0003] The relationship between the functional connectivity of neural circuits ...

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Problems solved by technology

This is for micron-scale small-scale patterned deposition of Ti / SiO 2 , not only the alignment is difficult, but also the device needs to be flipped after release, it is difficult to complete the precise alignment and deposition of multiple devices at one time, so there are deficiencies in the process

[0006] Xu S, Yan Z et al. wrote "Assembly of micro / nanomaterials into complex, three-dimensional architectures by compressive buckling" in Science, 2015, 347(6218):154-159, and proposed the mechanically guided formation of a variety of different materials The three-dimensional buckling structure, one of which is based on the sandwich structure of PI / metal / PI, while SiO 2 It is the deposition, photolithography mask and reactive ion etching patterning that are completed before making the sandwich structure. Not only is the process complicated, but the MEMS processing cost is also increased, and SiO 2 The upper surface needs to be in contact with PI. It was found through experiments that the device is easy to debond from the elastic substrate; even when depositing SiO 2 At the same time, a layer of Ti is deposited on the upper surface at the same time, and because the operation after the deposition and removal needs to be exposed to air, the surface of the metal Ti is oxidized, which will also affect the binding force with PI.

[0007] To sum up, the three-dimensional buckling structures reported so far are rarely applied to neural microelectrodes, and the patterning process steps of silica bonding points are still insufficient.

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