Treatment solution for copper residue on surface of dart fixture
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市航盛电路科技股份有限公司
- Publication Date
- 2019-10-25
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Abstract
Description
technical field
[0001] The invention relates to the technical field of metal surface treatment, in particular to a copper treatment solution for attaching copper to the surface of a flying target fixture. Background technique
[0002] PCB circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Copper electroplating is usually required when preparing PCB boards in industry. Copper is used to interconnect components on PCB boards and is a good conductor material for forming PCB conductive path board surface graphics. In the process of PCB board electroplating, it is usually necessary to use a dart fixture to clamp the PCB board. Since the end of the dart fixture is often soaked in the electroplating solution, the surface of the dart fixture is easy to attach metal copper to form a layer of copper attachment surface. When the dart fixture clamps the next unplated PCB board, the attached copper on its surface is eas...