Sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation

A technology of sealing electromagnetic and analytical methods, applied in design optimization/simulation, instrumentation, electrical and digital data processing, etc., can solve problems such as omission, influence analysis results, and difficulty in meeting engineering needs, achieve high analysis accuracy, improve calculation efficiency, The effect of high computational efficiency and accuracy

Active Publication Date: 2019-10-29
XIAN TECHNOLOGICAL UNIV
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Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-field finite element simulation method for temperature field analysis of sealed electromagnetic relays, to overcome the heat transfer path analysis ex

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  • Sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation
  • Sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with specific embodiments, wherein, the accompanying drawings are only used for exemplary illustrations, and what are shown are only schematic diagrams, not actual pictures, and should not be understood as limitations on this patent in order to better illustrate the implementation of the present invention For example, some components in the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some known structures and their descriptions in the drawings may be omitted.

[0023] see figure 1 , a method for analyzing the temperature field of a sealed electromagnetic relay based on multi-field finite element simulation, which specifically includes the following steps:

[0024] Step 1: Based on the ideal equivalent method, use UG modeling software to build a solid model of the sealed electromagnetic relay. ...

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Abstract

The invention relates to a sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation, and the method comprises the following steps: constructing a sealed electromagnetic relay complete machine entity model through UG modeling software based on an ideal equivalent method; importing the model into a thermoelectric coupling simulation module of ANSYS finite element analysis software, and establishing an ideal equivalent simulation model of the sealed electromagnetic relay by setting physical parameters of each component material, unit types during simulation calculation and a mesh division method; and respectively carrying out heat production analysis and calculation on a main heat source assembly control coil and a contact system of the sealed electromagnetic relay, carrying out heat dissipation analysis on the sealed electromagnetic relay based on a heat transfer theory, and completing application of load and boundary conditions duringthermoelectric coupling simulation calculation. Based on the ideal equivalent simulation model with the set load and boundary conditions, the influence condition of the environment temperature and the current intensity is acquired by calculation on the steady-state temperature field under the long-term working system of the relay and the transient temperature field under the short-term working system of the relay.

Description

technical field [0001] The invention belongs to the field of relay thermal performance protection, in particular to a simulation method for studying the influence of ambient temperature and current intensity on the temperature of a sealed electromagnetic relay in a multi-physical field environment, and in particular to a temperature field analysis method for a sealed electromagnetic relay with multi-field finite element simulation. Background technique [0002] At present, the sealed electromagnetic relay is constantly developing in the direction of miniaturization. The miniaturization is accompanied by the reduction of the overall space volume of the relay and the reduction of the effective heat dissipation area, which increases the heat per unit volume, which causes the temperature of the components that make up the electromagnetic relay to rise. , the temperature will have a certain impact on the insulation performance of insulating materials, the contact resistance of met...

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F2119/08G06F30/23Y02E60/00
Inventor 丁锋田敏樊亚军高云云王楠
Owner XIAN TECHNOLOGICAL UNIV
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