Sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation

Abstract

The invention relates to a sealed electromagnetic relay temperature field analysis method based on multi-field finite element simulation, and the method comprises the following steps: constructing a sealed electromagnetic relay complete machine entity model through UG modeling software based on an ideal equivalent method; importing the model into a thermoelectric coupling simulation module of ANSYS finite element analysis software, and establishing an ideal equivalent simulation model of the sealed electromagnetic relay by setting physical parameters of each component material, unit types during simulation calculation and a mesh division method; and respectively carrying out heat production analysis and calculation on a main heat source assembly control coil and a contact system of the sealed electromagnetic relay, carrying out heat dissipation analysis on the sealed electromagnetic relay based on a heat transfer theory, and completing application of load and boundary conditions duringthermoelectric coupling simulation calculation. Based on the ideal equivalent simulation model with the set load and boundary conditions, the influence condition of the environment temperature and the current intensity is acquired by calculation on the steady-state temperature field under the long-term working system of the relay and the transient temperature field under the short-term working system of the relay.

Description

technical field [0001] The invention belongs to the field of relay thermal performance protection, in particular to a simulation method for studying the influence of ambient temperature and current intensity on the temperature of a sealed electromagnetic relay in a multi-physical field environment, and in particular to a temperature field analysis method for a sealed electromagnetic relay with multi-field finite element simulation. Background technique [0002] At present, the sealed electromagnetic relay is constantly developing in the direction of miniaturization. The miniaturization is accompanied by the reduction of the overall space volume of the relay and the reduction of the effective heat dissipation area, which increases the heat per unit volume, which causes the temperature of the components that make up the electromagnetic relay to rise. , the temperature will have a certain impact on the insulation performance of insulating materials, the contact resistance of met...

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Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-field finite element simulation method for temperature field analysis of sealed electromagnetic relays, to overcome the heat transfer path analysis existing in the prior art It is easy to omit the situation when it is used, and the resulting errors will directly affect the final analysis results, and it is difficult to meet the needs of actual engineering defects.

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