EML laser emitter and receiver integrated packaging method and packaging structure

Abstract

The invention belongs to the technical field of optical communication and relates to a single-fiber bidirectional optical device packaging method and a packaging structure, in particular, an EML laseremitter and receiver integrated packaging method and packaging structure. The EML laser emitter and receiver integrated packaging method comprises the following steps of: (1) surface mounting; (2) coupling and surface mounting; and (3) receiver coupling and surface mounting. According to the EML laser emitter and receiver integrated packaging structure, a light emitting unit and a light receivingunit are arranged in a tube shell; a first 45-degree light splitting sheet is mounted to the front end of the light emitting unit through surface mounting; a second 45-degree light splitting sheet ismounted to the front end of the light receiving unit through surface mounting; an optical fiber insertion core is mounted at the front end of the tube shell through surface mounting; and a microwavebaffle is mounted between the light emitting unit and the light receiving unit through surface mounting. With the EML laser emitter and receiver integrated packaging method and packaging structure ofthe invention adopted, the technical problem of deep cavity packaging is solved. According to the coupling method, active and passive hybrid surface mounting is utilized skillfully so as to complete packaging, and therefore, a process is simplified. The integrated packaging structure is exquisite. A special microwave material is adopted, so that crosstalk between electric signals and optical signals is avoided. A high-performance integrated device is realized and can be directly applied to a terminal.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a single-fiber bidirectional optical device packaging method and packaging structure. Background technique [0002] With the rapid development of 5G, single-fiber bidirectional devices have become the mainstream devices of 5G. Before 5G, the direct connection mode is traditionally used, so the number of optical fibers must be controlled to a certain extent. Some manufacturers use the receiving device and the transmitting device through the laser Welding together, that is, BOSA or BIDI scheme, to realize the single-fiber bidirectional scheme. Since these manufacturers have no experience in device internal packaging, they use the device packaged by the device manufacturer, and then perform secondary processing, coupled and welded together. This method is used for welding. The common device has high power consumption, and there is a problem of crosstalk between electri...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the TO-CAN optical transceiver device packaging structure in the prior art is surface mount, can not solve the technical problems of deep cavity packaging, to provide a simple process, active and passive combination of EML laser emission Integrated packaging method with receiver

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