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Image sensor and forming method thereof

An image sensor and lens technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as errors and low detection efficiency of alignment marks, and achieve the effect of improving detection efficiency

Inactive Publication Date: 2019-11-05
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the process of wafer alignment using alignment marks, it is necessary to detect the alignment marks, but there are various errors in the process of detecting the alignment marks in the prior art, resulting in the detection efficiency of the alignment marks in the prior art Low

Method used

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  • Image sensor and forming method thereof

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Embodiment Construction

[0026] As mentioned in the background, the detection efficiency of existing alignment marks is low.

[0027] figure 1 It is a schematic diagram of the structure of an image sensor.

[0028] Please refer to figure 1 , the image sensor includes: a substrate 100, the substrate 100 includes an adjacent unit area A and a cutting area B; the cutting area A has several mutually separated alignment marks 110, and the alignment marks 110 are located at the bottom of the substrate 100.

[0029] When the alignment mark 110 is used for pattern recognition, it is necessary to store the reference pattern of the alignment mark in advance, and then detect the alignment mark on the wafer entering the machine to obtain the detection pattern, and match it with the reference pattern to determine the alignment mark. Align the position of the mark.

[0030] According to actual needs, usually a black photoresist is formed on the surface of the substrate 100 to reduce noise, thereby improving the ...

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Abstract

Disclosed are an image sensor and a forming method thereof; the method comprises the following steps of providing a substrate, wherein the substrate comprises a plurality of mutually separated unit areas, and a cutting area is formed between adjacent unit areas; forming an initial lens layer on the surface of the unit area of the substrate and the surface of the cutting area; etching a part of theinitial lens layer on the surface of the cutting area until the surface of the substrate is exposed, and forming a plurality of mutually separated alignment marks on the surface of the cutting area.The method can improve the detection efficiency of alignment marks.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular to an image sensor and a forming method thereof. Background technique [0002] An integrated circuit is made up of many circuit elements formed on a substrate and multiple layers of dielectric layers and metal interconnects stacked above the substrate. With the shrinking of the design line width of integrated circuits and the continuous improvement of integration, wafer alignment accuracy (alignment accuracy) is very important when exposing the wafer. [0003] In the existing semiconductor manufacturing process, before semiconductor devices are fabricated on the wafer, the wafer needs to be layout designed, and the wafer is divided into several unit areas (Die) and scribe lines located between the unit areas. . The unit area is used for subsequent formation of a semiconductor device, and the cutting groove is used as a cutting line for dividing the unit area at the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/544H01L27/146
CPCH01L23/544H01L27/14627H01L27/14685
Inventor 张瑞鸿张松
Owner HUAIAN IMAGING DEVICE MFGR CORP