Solid cold plate based on low-dimensional thermal diffusion material

Abstract

The present invention relates to a solid cold plate based on a low-dimensional thermal diffusion material. The solid cold plate comprises a cold plate substrate 1, a cold plate cover 2, and a two-dimensional high efficiency thermal diffusion coating (graphene coating) 3. One end of the cold plate cover 2 is coated with a graphene coating and is welded with the cold plate substrate 1 by adopting adiffusion welding method to allow the graphene coating to be in tight contact with the substrate to form the solid cold plate. A heating body is installed in a heating body mounting groove on the coldplate substrate 1 for heat dissipation, and a grapheme heat conduction pad is added between the heating body mounting groove and a boss to further reduce the heat resistance so as to ensure the extrahigh heat expansion of the cold plate on the two-dimensional plane. The solid cold plate has no liquid state working medium leakage danger, is high in reliability, reduces the process complexity, andhas an excellent anti-gravity performance; and moreover, the multi-layer graphene coating fully distributes heat on the two-dimensional plane, dissipates heat is large to facilitate control of the temperature of the heating body in an idea range, and therefore, the solid cold plate can be widely applied to heat dissipation of the electronic elements.

Description

technical field [0001] The invention relates to a cooling device for electronic components, in particular to a solid cold plate. Background technique [0002] The cold plate is directly responsible for the heat exchange between the heat source and the cold source in the mainstream heat dissipation system. The quality of its design directly determines the heat dissipation efficiency of the system and the maximum temperature and temperature uniformity of the device. The design of the cold plate is the key to enhancing heat transfer. . [0003] Now liquid-cooled and air-cooled cold plates have begun to be widely used in heat dissipation systems. For example, in invention patents 201811626190.2 (a water-cooled plate) and 201711443413.7 (quick-cooled plate) and utility model ZL201721673277.6 (water-cooled plate), the cold plate is divided into two upper and lower cover plates, and multiple strips are machined between the cover plates. The flow channel is used to cool the heat g...

AI Technical Summary

Problems solved by technology

However, these liquid-cooled cold plates need to design complex, small air ducts and flow channels in order to improve heat dissipation efficiency.

Therefore, the thickness and spacing of the internal fins are generally relatively small, and in order to facilitate the installation of electronic components, the fins inside the flow channel are quite different, and it is difficult to process them with conventional processing methods. longer period

In addition, ordinary liquid-cooled and air-cooled cold plates are greatly affected by gravity, and their performance will drop significantly under severe conditions such as rotation and overload

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