A method of pcb silk screen printing solder resist ink for small-pitch pads
A technology of solder mask ink and screen printing ink, applied in the secondary treatment of printed circuits, sustainable manufacturing/processing, climate sustainability, etc. Avoid the effect of short circuits
Active Publication Date: 2022-05-20
惠州美锐电子科技有限公司
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Problems solved by technology
Solder resist ink (that is, oil bridge) needs to be made between adjacent pads on the PCB to avoid short circuit between adjacent pads during patching. For some PCBs with too small pad spacing, the general screen printing process is used to make resist When soldering the ink layer, the oil bridge is easy to be side-eroded, which will cause the oil bridge to fall off, affect the quality of the PCB, and even directly cause the entire board to be scrapped after placement
Method used
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Embodiment 1
[0030] refer to Figure 1~7 A method for screen printing solder resist ink on PCB with small pitch pads, used for silk screen printing of solder resist ink on the surface of PCB when the pitch of pads is small. The solder resist ink is screen-printed on the surface of the PCB 1 twice, and the solder resist ink is screen-printed on the pad area b for the first time (the pad area b includes the surfaces of multiple adjacent pads 11 and the PCB between adjacent pads. Surface area), mainly to complete the silk screen printing of solder resist ink (ie, oil bridge) between 11 adjacent pads; secondly, silk screen solder resist ink on the area a outside the pad area on the PCB, and complete the entire surface of the PCB requires silk screen solder resist Silkscreen for ink placement.
[0031] The schematic diagram of the PCB surface structure before the first silk screen printing solder resist ink is as follows figure 1 As shown, the first screen printing solder resist ink includes ...
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Abstract
The invention discloses a method for PCB silk screen printing solder resist ink on pads with small spacing, which is characterized in that: screen print solder resist ink on the surface of PCB twice, the first time screen print solder resist ink on the pad area, and the second time on the solder resist ink Silk screen solder resist ink on the PCB outside the pad area; the first silk screen solder resist ink includes the following steps: S1, silk screen ink, silk screen ink on the position between adjacent pads in the pad area, and the area of the silk screen ink is expanded to solder On the disk; S2, pre-drying treatment, drying the ink of the silk screen to a non-stick object; S3, exposure treatment, exposing the ink of the silk screen printing in the area between the pads, and expanding the exposure area to the pad; S4, development treatment , remove the unexposed ink on the pad and the outside of the pad through the developer; S5, curing treatment, curing the ink left by the development between the pads and on the pad; S6, grinding treatment, curing the ink on the pad Ink sanding to remove. The invention is used for PCB silk screen solder resist ink for small-pitch pads.
Description
technical field [0001] The invention relates to the technical field of PCB production and processing, in particular to a method for PCB silk screen printing solder resist ink for small-pitch pads. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is a commonly used component in electrical equipment. Usually, various components need to be mounted or inserted on the PCB to form electrical functional modules to realize various functions of electrical equipment. After the circuit on the PCB is completed, it is necessary to screen-print solder resist ink on the surface to protect the circuit on the PCB and avoid short circuits between pads when components are mounted. With the ever-changing changes, the SMT components are getting smaller and smaller, and the PIN pins of the components are getting denser. These directly affect the structure of the PCB board, resulting in smaller and smaller spacing between the pads on the PCB. Solder resist ink (tha...
Claims
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IPC IPC(8): H05K3/28
CPCH05K3/28Y02P70/50
Inventor 陈超兵
Owner 惠州美锐电子科技有限公司