Radio frequency device

Abstract

The invention provides a radio frequency device, which comprises a frame and a plastic package material coated outside the frame; a chip and a conductive pad are arranged on the frame, the chip is electrically connected with the conductive pad through an inner lead, the chip and the inner lead are coated by the plastic package material, and the conductive pad is exposed out of the outer surface ofthe plastic package material and used for being welded with a circuit board. Compared with the prior art, the radio frequency device adopts a flat package formed by coating the frame with the plasticpackage material, is small in size, thin in thickness and light in weight, is suitable for an electronic product with a narrow installation space, has very low impedance and self-inductance, and canmeet the application in the field of microwave or communication; meanwhile, the solid structure formed by coating the frame with the plastic package material can significantly improve the strength ofthe radio frequency device, reduce the brittleness of the radio frequency device and make the radio frequency device not easy to damage. Moreover, the radio frequency device adopts a pin-free design,and is directly welded with the circuit board by using the conductive pad, so that the requirement on the size of the circuit board is reduced, and the radio frequency device can be applied to the circuit board with a smaller size.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a radio frequency device. Background technique [0002] Packaging refers to connecting the circuit pins on the silicon chip to the external joints with inner leads to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the contacts on the chip to the frame of the package shell with the inner lead, and these frames are passed through the inner lead on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand...

AI Technical Summary

Problems solved by technology

[0003] Most of the existing radio frequency devices use ceramics, glass or metal as packaging materials, which have defects such as large volume, high requirements for installation space, low cost performance, high brittleness, and easy to be damaged by stress, etc., and the production cost is high and the production process is complicated, so it is not suitable for Automated manufacturing

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