Web-like spider silk packed hydrogel high-thermal-conductivity insulating elastomer thermal interface material and preparation method thereof

A technology of thermal interface material and spider silk, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of not exerting to the extreme, the decline of electrical insulation performance, and the increase of process cost, so as to improve the flexibility, electrical properties, etc. The effect of excellent insulation performance and excellent fiber flexibility

Active Publication Date: 2019-11-26
上海叠泰材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these patents, although the filling of heat-conducting particles improves the thermal conductivity of TIM to a certain extent, while increasing the process cost, the more critical is the introduction of structural defects, which generate interfacial thermal resistance at the bonding interface between the matrix and heat-conducting particles. ;In addition, the thermally conductive particles will increase the possibility of TIM electrical insulation performance decline, or affect its flexibility; and the intrinsic thermal conductivity of the thermally conductive particles will not be maximized due to various factors

Method used

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  • Web-like spider silk packed hydrogel high-thermal-conductivity insulating elastomer thermal interface material and preparation method thereof
  • Web-like spider silk packed hydrogel high-thermal-conductivity insulating elastomer thermal interface material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0025] In this example, a highly thermally conductive insulating elastomer thermal interface material filled with web-like spider silk and hydrogel is prepared. In the homogeneous system, the homogeneous mixture of HEC and AA is quickly poured into the suspension, and reacted in a high temperature environment to prepare the elastomeric thermal interface material. Specific steps are as follows:

[0026] (1) Preparation of spider silk / APS suspension: Stretch the natural high-purity spider evenly into a silk net shape, select an area with smooth silk, uniform thickness, and uniform grid, and cut it into a square with a size of 100mm×100mm with scissors. Dissolve 0.01g of initiator APS in 10ml of deionized water, use tweezers to pick up the web-like sheet spider silk and place it in a 100mm×100mm×2.5mm square mold filled with APS aqueous solution, and place 3 layers in sequence;

[0027] (2) Preparation of HEC / PAA hydrogel filled with multi-layer web-like spider silk: Dissolve 0....

Embodiment 2

[0029] In this example, a highly thermally conductive insulating elastomer thermal interface material filled with web-like spider silk and hydrogel is prepared. In the homogeneous system, the homogeneous mixture of HEC and AA is quickly poured into the suspension, and reacted in a high-temperature environment to prepare the elastomeric thermal interface material. Specific steps are as follows:

[0030] (1) Preparation of spider silk / APS suspension: Stretch the natural high-purity spider silk evenly into a silk net shape, select an area with smooth silk, uniform thickness, and uniform grid, and cut out a 100mm×100mm square with scissors . Dissolve 0.01g of initiator APS in 10ml of deionized water, use tweezers to pick up the web-like sheet spider silk and place it in a 100mm×100mm×2.5mm square mold filled with APS aqueous solution, and place 3 layers in sequence;

[0031] (2) Preparation of HEC / PAA hydrogel filled with multi-layer web-like spider silk: Dissolve 1 g of HEC in ...

Embodiment 3

[0033] In this example, a highly thermally conductive insulating elastomer thermal interface material filled with web-like spider silk and hydrogel is prepared. In the homogeneous system, the homogeneous mixture of HEC and AA is quickly poured into the suspension, and reacted in a high-temperature environment to prepare the elastomeric thermal interface material. Specific steps are as follows:

[0034] (1) Preparation of spider silk / APS suspension: Stretch the natural high-purity spider silk evenly into a silk net shape, select an area with smooth silk, uniform thickness, and uniform grid, and cut out a 100mm×100mm square with scissors . Dissolve 0.01g of initiator APS in 10ml of deionized water, use tweezers to pick up the web-like sheet spider silk and place it in a 100mm×100mm×2.5mm square mold filled with APS aqueous solution, and place 3 layers in sequence;

[0035] (2) Preparation of HEC / PAA hydrogel filled with multi-layer web-like spider silk: Dissolve 1.5g HEC in 15...

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Abstract

The invention discloses a web-like spider silk packed hydrogel high-thermal-conductivity insulating elastomer thermal interface material and a preparation method thereof. The preparation method of thehigh-thermal-conductivity insulating elastomer thermal interface material comprises the following steps: pouring a uniform mixed solution of hydroxyethyl cellulose and acrylic acid into a heterogeneous system of a monomer radical polymerization initiator suspension having multilayered web-like spider silk stack, and performing a reaction in a high-temperature environment to prepare the elastomerthermal interface material. The method provided by the invention has a simple process; the obtained web-like spider silk-packed hydrogel high-thermal-conductivity insulating elastomer thermal interface material has excellent thermal conductivity, flexibility and insulation properties, and has more advantages in application to electronic components and heat sinks.

Description

technical field [0001] The invention relates to the technical field of elastomeric thermal interface materials, in particular to a highly thermally conductive and insulating elastomeric thermal interface material filled with web-like spider silk and a hydrogel and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic technology, the performance of electronic products has been improving day by day, and the degree of miniaturization, integration, and densification has also been increasing. At the same time, the power consumption and heat generation of electronic products have also increased sharply. High temperatures can reduce the stability, reliability and lifespan of electronic equipment. The way to solve this problem is to use a thermal interface material (Thermal Interface Material, TIM) with high thermal conductivity to place between the heating electronic components and the heat sink, occupy the gap between...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/075C08L33/02C08L1/28C09K5/14
CPCC08J3/075C08J2333/02C08J2389/00C08J2401/28C08J2489/00C09K5/14
Inventor 于伟陈程杨杰王德兵徐广桥
Owner 上海叠泰材料科技有限公司
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