A kind of matting agent and its preparation method, the underfill glue containing it and its application

Abstract

The invention provides a matting agent and a preparation method thereof, an underfill glue containing the same and its application. The matting agent is silicon dioxide modified by silicone resin; wherein, the silicone resin is methyl silicone resin. The cured underfill adhesive provided by the invention has low reflectivity, low curing temperature, stable performance and good heat and humidity resistance, and can be used as an underfill adhesive for LED display screens.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to a matting agent, a preparation method thereof, a bottom filling adhesive containing the same, and an application thereof. Background technique [0002] LED display (LED display) is composed of tens of thousands to hundreds of thousands of pixels of semiconductor light-emitting diodes evenly arranged. It is a way to display text, graphics, images, animations, market prices, videos, and video A device for various information such as signals. LED display has the advantages of long life, wide brightness range, large viewing angle, strong sense of presence, low power consumption, and easy automatic control. As one of the important modern information release media, it is widely used in advertising media, stadiums, and stages. Background, municipal engineering and other fields. LED display device packaging has gone through four stages: dot matrix module, in-line, three-in-one surface ...

AI Technical Summary

Problems solved by technology

However, most of the current underfills are directly transplanted from the field of integrated circuits. After curing, the surface gloss is high, and there are obvious reflections, which will increase the surface reflectivity of the screen, thereby reducing the contrast and clarity of the LED display. degree, affecting the visual effect

In addition, the current underfill material needs to be cured at a temperature above 100°C, which is unacceptable for display modules after surface-mounting LED lamp beads; secondly, the glass transition temperature of the cured product is low (most of them are less than 90°C ), poor heat and humidity resistance

[0004] CN103361016A discloses an underfill adhesive composition, which consists of the following raw materials in parts by weight: 50-80 parts of hydrogenated epoxy resin, 1-10 parts of modified resin, 10-30 parts of toughening resin, 1- Combination of 5 parts, the preparation method is: adjust the production environment to a temperature of 15-28 ℃, and the relative humidity is less than 70%, add the hydrogenated epoxy resin to the vacuum stirring tank in sequence according to the formula and stir, and evenly add the modified resin , mix evenly, add curing agent, mix evenly, vacuum mix evenly, degassing and filtering into storage, although this patent does not need preheating when used, and the curing speed is fast, but it does not study its gloss

The underfill provided by this patent can improve the temperature resistance, corrosion resistance, weather resistance, etc. after the glue is cured, but its gloss may be high, and it is not suitable for use as an underfill for LED displays.

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