Production method suitable for pickup head for microchip mass transfer

A production method and pick-up head technology, which is applied in the direction of measuring device casing, semiconductor/solid-state device testing/measurement, conveyor objects, etc., can solve the problems of low handling efficiency and achieve the effect of increasing handling speed and chip spacing

Active Publication Date: 2019-11-26
义乌臻格科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides a production method suitable for mass-transfer pickup heads of microchips; it solves the problem of low handling efficiency in the prior art

Method used

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  • Production method suitable for pickup head for microchip mass transfer
  • Production method suitable for pickup head for microchip mass transfer
  • Production method suitable for pickup head for microchip mass transfer

Examples

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Embodiment 1

[0022] Example 1: see figure 1 , a production method suitable for mass transfer pick-up heads for microchips, this type of pick-up head is suitable for picking up microchips with a specification of 5-100 microns. Step 1: Use ceramic sintering technology to sinter the columnar pick-up head 1 at one time. The upper end surface of the pick-up head 1 is sintered downward at the same time to form M×N air channels 2 that are independent of each other and have a pore size of 100-1000 microns. Road 2 is provided with a blind hole; step 2, between the lower end of each air channel 2 and the lower end surface of the pick-up head 1, a micro air channel 3 with a diameter of 3 to 5 microns is connected (see Figure 4 ), the micro-air channel 3 can be processed directly on the lower end surface of the pick-up head 1 by laser drilling technology, or by an etching process (see Figure 6 and Figure 7 ), this process also needs to first process a positioning sinker 13 on the lower end surfac...

Embodiment 2

[0023] Example 2: see figure 2, a production method suitable for mass transfer pick-up heads for microchips, this type of pick-up head is suitable for picking up microchips with a specification of 5-100 microns. Step 1: Use ceramic sintering technology to sinter the columnar pick-up head 1 at one time. The upper end surface of the pick-up head 1 is sintered downward at the same time to form M×N air channels 2 that are independent of each other and have a pore size of 100-1000 microns. Road 2 is set as a blind hole; Step 2, between the lower end of each air channel 2 and the lower end surface of the pick-up head 1 is connected with a micro air channel 3 with a diameter of Figure 4 ), the micro-air channel 3 can be processed directly on the lower end surface of the pick-up head 1 by laser drilling technology, or by an etching process (see Figure 6 and Figure 7 ), this process also needs to first process a positioning sinker 13 on the lower end surface of the pickup head 1, ...

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Abstract

The invention relates to a production method suitable for a pickup head for microchip mass transfer. The method comprises following steps of first, sintering a column-shaped pickup head once by usinga ceramic sintering technology, wherein M*N gas channels are simultaneously processed and shaped downward on the upper end surface of the pickup head; second, collecting a micro gas channel between the lower end of each gas channel and the lower end surface of the pickup head; third, providing a sealing shell; fourth, punching on the sealing shell, then installing an air vent valve and an air suction valve that communicate with an inner cavity of the sealing shell; and fifth, connecting the sealing shell and the upper end of the pickup head in a sealing manner, and guaranteeing that each valveis opposite to an upper opening of each gas channel. Due to use of a mechanism of single mass transfer, chip transfer efficiency is improved greatly.

Description

technical field [0001] The invention relates to a method for manufacturing a mechanical handling device, in particular to a production method suitable for a pick-up head for mass transfer of microchips. Background technique [0002] LEDs have a huge market application in the display industry. As the requirements for clear images become higher and higher, the size of LED chips will become smaller and smaller. The side length of traditional display LED chips is more than 750 microns, and the size of Micro LEDs in the future will be smaller than 100 microns, or even smaller than 10 microns. Miniaturized Micro LEDs will bring challenges to measurement methods, chip transfer methods, and packaging methods. At present, the chip industry uses sorting machines to handle chips on substrates. At present, someone has invented a patent called "chip sorting machine" (Chinese patent number: 200820152438.1), which includes a nozzle cap, a vacuum tube and a nozzle rod fixed on the swing a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683H01L21/66G01R1/04
CPCH01L21/677H01L21/6838H01L21/67271H01L22/30G01R1/04
Inventor 朱干军徐竞张家尧陈雄群
Owner 义乌臻格科技有限公司
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