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Cascaded modulator of optical analog-to-digital conversion chip and heterogeneous packaging of radio frequency integrated circuit

A technology of radio frequency integrated circuits and modulators, applied in the direction of circuits, optical waveguide coupling, instruments, etc., can solve the problems of large volume, large microwave transmission loss, unstable connection, etc., achieve high integration, reduce transmission loss, The effect of stable performance

Active Publication Date: 2022-01-28
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the existing technology, the modulator topology chip and the microwave chip are separately packaged and connected by cables, which face disadvantages such as slightly larger volume, large microwave transmission loss, and unstable connection.

Method used

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  • Cascaded modulator of optical analog-to-digital conversion chip and heterogeneous packaging of radio frequency integrated circuit
  • Cascaded modulator of optical analog-to-digital conversion chip and heterogeneous packaging of radio frequency integrated circuit
  • Cascaded modulator of optical analog-to-digital conversion chip and heterogeneous packaging of radio frequency integrated circuit

Examples

Experimental program
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Effect test

Embodiment

[0025] refer to figure 1 , figure 1 It is a cross-sectional view of an embodiment of heterogeneous packaging of a cascaded modulator based on an optical analog-to-digital conversion chip and a radio frequency integrated circuit of the present invention. It can be seen from the figure that the heterogeneous packaging of the cascaded modulator and radio frequency integrated circuit of the optical analog-to-digital conversion chip of the present invention includes a cascaded modulator chip layer 1, a silicon substrate 3, a dielectric wiring layer 4, and a radio frequency integrated circuit arranged in sequence from top to bottom. Integrated circuit 2, surrounding frame 5 and cover plate 6.

[0026] refer to figure 2 , the chip layer of the cascaded modulator adopts a plurality of cascaded modulation waveguides, and the light inlet port performs grating or end face coupling through the modulation waveguides;

[0027] refer to image 3 , the silicon substrate 3 is provided wit...

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Abstract

A cascaded modulator of an optical analog-to-digital conversion chip and a radio frequency integrated circuit is heterogeneously packaged, which is characterized in that it includes a cascaded modulator chip layer, a silicon substrate, a dielectric wiring layer, a radio frequency integrated circuit, and a surrounding frame and cover. The invention integrates the cascaded cascaded modulator chip and the radio frequency integrated circuit in the same module, so the integration degree is high and the performance is stable. At the same time, the invention integrates cascaded modulator chips on the front side of the silicon substrate, integrates radio frequency integrated circuits on the back side, and transmits microwave signals through the feeding network, greatly reducing the transmission loss of microwave signals.

Description

technical field [0001] The invention relates to microwave photon integration, in particular to a heterogeneous packaging of a cascaded modulator of an optical analog-to-digital conversion chip and a radio frequency integrated circuit. Background technique [0002] With the continuous development of optical signal processing and conversion, high-resolution measurement equipment, and optical signal quality detection, the requirements for analog-to-digital conversion technology are getting higher and higher. Due to the "electronic bottleneck" encountered by traditional electronic technology, it is a great challenge to further improve the performance of electronic analog-to-digital conversion. The photonic analog-to-digital conversion technology (hereinafter referred to as PADC) can effectively improve the performance of the analog-to-digital conversion system by utilizing the high-speed and broadband characteristics of photons, thus providing an effective way for the developmen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L23/48H01L23/31G02B6/12G02B6/42H04B10/40H04B10/516
CPCH01L25/16H01L25/167H01L23/481H01L23/3121G02B6/12004G02B6/4201H04B10/40H04B10/516G02B2006/12142H01L2924/15174
Inventor 邹卫文李俊燕李杏于磊陈建平
Owner SHANGHAI JIAOTONG UNIV