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Micro-lens array integrated in image sensor and preparation method thereof

A microlens array and image sensor technology, applied in the field of microlenses, can solve the problems of microlens lithography angle difference, microlens fusion, and microlens abnormality, and achieve the effect of simple preparation method and avoiding fusion

Active Publication Date: 2019-12-06
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is worth noting that, as attached figure 1 As shown in the above steps, the flat layer 3 is globally covered, that is, it is covered on the light blocking plate 2 and the substrate 1 at the same time. Since the light blocking plate 2 has a certain height, the flat layer 3 around the light blocking plate 2 is not flat. Instead, it has a certain included angle with the substrate, which is generally 70-80°; the included angle on the flat layer makes the etching layer deposited on the flat layer also have a corresponding included angle, and at the same time, due to the The etch layer needs to be etched into microlenses, especially for uneven areas, the difference in the lithography angle of the microlenses is caused during the etching process, thus forming the phenomenon of microlens fusion, such as attached figure 1 As shown; that is, the microlenses located in the uneven area are connected together, making the microlenses abnormal in shape and affecting the sensitivity of the image sensor

Method used

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  • Micro-lens array integrated in image sensor and preparation method thereof
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  • Micro-lens array integrated in image sensor and preparation method thereof

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0027] A method for preparing a microlens array integrated in an image sensor provided by the present invention comprises the following steps:

[0028] S01: Please refer to the attached figure 1 , prepare light blocking plate 2 on substrate 1 . Wherein, the substrate can be a silicon substrate, and the light blocking plate can be a metal light blocking plate. In the image sensor, the microlens array is formed in the effective pixel area, and some circuits are also included outside the effective pixel area. Between the microlens array and the peripheral circuit A light baffle needs to be provided, and the light baffle is arranged around the microlens array to prevent incident light from entering the peripheral circuit when e...

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Abstract

The invention discloses a preparation method of a micro-lens array integrated in an image sensor. The preparation method comprises the following steps: S01, forming a light barrier on the upper surface of a substrate; S02, covering the upper surfaces of the light barrier and the substrate with M flat layers, and controlling the number of the flat layers so that the included angle between the uppermost flat layer located on the edge of the light barrier and the substrate is made to be (0 degree, 30 degrees), wherein M is a positive integer greater than 0; S03, depositing an etching layer on theflat layer; S04, photoetching a micro-lens array in the etching layer, wherein the micro-lens array is located between the light barriers. According to the micro-lens array integrated in the image sensor and the preparation method of the micro-lens array, the micro-lens fusion phenomenon can be effectively avoided, and the sensitivity of the image sensor is improved.

Description

technical field [0001] The invention relates to the field of microlenses, in particular to a microlens array integrated in an image sensor and a preparation method thereof. Background technique [0002] The microlens array is an array composed of a series of tiny lenses with diameters ranging from a few micrometers to hundreds of millimeters in a certain arrangement. It is widely used in optical information processing, beam shaping, optical device interconnection, three-dimensional imaging and other fields. [0003] High-sensitivity and high-resolution imaging detection systems usually require image sensors with high responsivity and detection rate, low noise, large number of pixels, small pixel size and large fill factor. Due to the difficulties in material preparation and process manufacturing, these requirements are generally difficult to achieve at the same time. For example, the improvement of spatial resolution can be achieved by reducing the size of the pixel and incr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14685H01L27/14627
Inventor 史海军叶红波温建新李冲
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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