Protective agent for tin-plated layer of electronic component pins

A technology of electronic components and protective agents, applied in coatings, anti-corrosion coatings, etc., can solve the problems of reducing the reliability of electronic components and hidden dangers of product quality, etc.

Active Publication Date: 2021-05-18
DONGGUAN TONGKE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the corrosion and oxidative discoloration of component pins reduce the reliability of electronic component products and bring serious quality hidden dangers to products

Method used

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  • Protective agent for tin-plated layer of electronic component pins
  • Protective agent for tin-plated layer of electronic component pins

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of protective agent of tin-plated layer of electronic component pin is inorganic-organic composite treatment liquid, wherein water-based acrylic resin is 150g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0023] The preparation of the protective agent for the tin-plated layer of the pins of the above-mentioned electronic components specifically includes the following steps:

[0024] (1), add 0.6L deionized water in the beaker;

[0025] (2), take by weighing water-based acrylic resin to be 150g respectively, silica sol is 40g, zinc gluconate 10g, dimethylethanolamine 10g, benzotriazole 1.5g, under the condition of stirring, join described in step (1) Add water to the beaker until the volume of the mixed solution is 1.0L to obtain the required protective agent A.

Embodiment 2

[0027] A kind of protective agent of tin-plated layer of electronic component pin is an inorganic-organic composite treatment solution, wherein water-based acrylic resin is 100g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0028] The preparation of the protective agent of above-mentioned a kind of electronic component pin tin-plated layer, just the water-based acrylic resin described in the step (2) is 100g, and other is with embodiment 1, finally obtains required protective agent B.

Embodiment 3

[0030] A kind of protective agent of tin-plated layer of electronic component pin is inorganic-organic composite treatment liquid, wherein water-based acrylic resin is 200g / L, silica sol is 40g / L, zinc gluconate 10g / L, dimethylethanolamine 10g / L L, benzotriazole 1.5g / L.

[0031] The preparation of the protective agent of above-mentioned a kind of electronic component lead tin-plated layer, just the water-based acrylic resin described in the step (2) is 200g, and other is with embodiment 1, finally obtains required protective agent C.

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PUM

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Abstract

The invention discloses a protective agent for the tin-plated layer of electronic component pins. The protective agent comprises the following components: water-based acrylic resin, 100-200g / L; silica sol, 30-50g / L; glucose Zinc acid, 5-15g / L; dimethylethanolamine, 5-15g / L; and benzotriazole, 1-2g / L. The beneficial effect of the invention is to improve the corrosion resistance of the tin coating on the pins of the electronic components and prevent the oxidation and discoloration of the tin coating on the pins of the electronic components.

Description

technical field [0001] The invention belongs to the field of packaging of electronic components and relates to a protective agent for tin-plated layers of pins of electronic components. Background technique [0002] In the tinning process of electronic component pins, due to the complexity of the tinning process, there will inevitably be a small amount of pores and cracks in the tin plating layer. At the same time, the lead tin plating generally adopts an acidic tin plating system, and the acidic plating solution has certain residues on the surface of the lead, especially in the defects such as pores and cracks [Xu Hao, Cause Analysis of Common Defects in Electroplating in Electronic Packaging, Electroplating and Finishing, 2008 (8): 21-23]. These factors reduce the corrosion resistance of component leads. In addition, during the long-term storage and processing of electronic components, the tin coating is exposed to the air, which will form oxides with the oxygen in the a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D133/04C09D5/08C09D7/61C09D7/63
CPCC08K2201/011C08L2203/20C09D5/08C09D133/04C09D7/61C09D7/63C08K3/36C08K5/098C08K5/17C08K5/3475C08K13/02
Inventor 郭晓明钟平权
Owner DONGGUAN TONGKE ELECTRONICS CO LTD
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