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Defect inspection apparatus and defect inspection method

A defect inspection and mounting platform technology, which is applied in the direction of measuring devices, material defect testing, and material analysis through optical means, can solve problems such as damage, short circuit, and rising insulation of hollow parts, so as to improve detection resolution and inspection resolution rate, the effect of suppressing temperature rise

Inactive Publication Date: 2019-12-27
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a large current is applied to a semiconductor module having a large-sized cavity at the solder joint, the temperature of the cavity may rise rapidly and insulation breakdown, or short circuit, may occur.

Method used

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  • Defect inspection apparatus and defect inspection method
  • Defect inspection apparatus and defect inspection method
  • Defect inspection apparatus and defect inspection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0049] figure 1 It is a figure which schematically shows the structure of the defect inspection apparatus of Embodiment 1.

[0050] The defect inspection device includes a stage 3, a stage controller 8, a laser light source 1, an infrared camera 2, a CCD (Charge Coupled Device, charge-coupled device) camera 4, a control device 6a, a control PC (Personal Computer, personal computer) 6b, and a light beam. Damper 11 , cooler 9 , refrigerant pipe 12 and case 5 .

[0051] The mounting table 3 , the mounting table controller 8 , the laser light source 1 , the infrared camera 2 , the CCD camera 4 , and the beam damper 11 are arranged inside the casing 5 . That is, the case 5 covers a range where there is a possibility of propagation or scattering of laser light. The control device 6 a , the control PC 6 b , the stage controller 8 , and the cooler 9 are provided outside the casing 5 .

[0052] The sample 17 placed on the stage 3 has a structure in which a plate-shaped substrate 15 as...

example 2

[0135] The defect inspection apparatus according to Modification 2 of Embodiment 1 further includes a blowing device (not shown) that blows air toward the surface 16 a of the semiconductor chip 16 . Blowing device sprays N 2 or reducing gases. A reducing gas such as H 2 Wait.

[0136] Since the defect inspection device has the blowing device, it can be cooled by a cooling method different from that of the first embodiment. That is, the blowing device cools by blowing air to the surface 16 a of the semiconductor chip 16 . In addition, such a blowing device can remove foreign matter and the like adhering to the surface 16 a of the semiconductor chip 16 while cooling the sample 17 . Therefore, it is possible to reduce the air blowing process for removing foreign substances on the surface 16a. Moreover, the control PC6b of a defect inspection apparatus does not misjudge a foreign object as a cavity, and can detect a cavity more accurately.

[0137] In addition, the defect in...

Embodiment approach 2

[0139] A defect inspection device according to Embodiment 2 will be described. Note that descriptions of the same configuration and operations as those in Embodiment 1 are omitted. Figure 18 It is a figure which schematically shows the structure of the defect inspection apparatus of Embodiment 2. The defect inspection device according to Embodiment 2 is provided with a mask 20 including an opening 21 .

[0140] The mask 20 is installed above the stage 3 . The sample 17 set on the stage 3 is located between the mask 20 and the stage 3 . The mask 20 may be located in the air above the substrate 15 , and may be in contact with the substrate 15 when the thickness of the mask 20 is thicker than that of the semiconductor chip 16 . Figure 19 A top view of sample 17 and mask 20 is shown. The area of ​​the mask 20 is larger than the laser irradiation region 1c. Although not shown, the mask 20 has a cooling mechanism inside the mask, and the cooling mechanism is connected to the ...

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Abstract

The purpose of the present invention is to provide a defect inspection apparatus which suppresses a rise in temperature outside the inspection region and improves the detection resolution of a void when a sample (17) serving as an object to be inspected is heated by laser radiation and inspected. The defect inspection apparatus comprises: a stage (3) on which a sample (17) including a first member(15) and a second member (16) joined by a joining material is placed; a laser light source (1) for heating the sample by irradiating a laser onto the surface of the second member (16) included in thesample (17) in which the first member (15) is placed on the stage (3); and an infrared camera (2) for detecting infrared rays emitted from the surface of the second member (16) heated by the laser. The stage (3) includes a cooling unit (3a) for cooling the first member (15) included in the sample (17).

Description

technical field [0001] The present invention relates to a defect inspection device and a defect inspection method for nondestructively inspecting a junction between components. Background technique [0002] Semiconductor chips in electronic components are soldered and mounted on substrates and lead frames. The joint quality of a solder joint is determined by the size or number of solder voids inherent in the solder joint. The state of solder voiding is often quantified by X-ray inspection as a non-destructive inspection. The inspection time for solder voids by X-ray inspection becomes longer as the structure of electronic components becomes more complicated. Especially in semiconductor modules for electric power, the application of three-dimensional wiring is expanding, and the development of increasing the area of ​​semiconductor chips is progressing, so the inspection time for solder voids by X-ray inspection tends to be longer. [0003] Similar to X-ray inspection, ult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/72G01N21/956
CPCG01N21/956G01N25/72
Inventor 川岛裕史上田高敬江草稔境纪和锦户良太
Owner MITSUBISHI ELECTRIC CORP