Reinforced sealing case based on MTCA standard and assembling method thereof

Abstract

The invention discloses a reinforced sealing case based on an MTCA standard, which is characterized in that radiating fins are uniformly arranged on the outer surfaces of a top cover plate and a bottom cover plate of a case body, and air duct inlets and outlets are formed in the tops and the bottoms of a front panel assembly and a rear panel assembly; more than one module is placed in the case, and the module comprises an AMC module; a reinforced cold guide plate is arranged on the module and is used for transferring heat generated by the AMC module to the cooling fins. According to the reinforced sealing case, the environmental adaptability of existing electronic equipment such as communication equipment or navigation equipment, especially military communication equipment or navigation equipment used under severe environmental conditions can be improved, and the equipment has excellent assembly and maintenance performance, three-proofing capacity, heat dissipation capacity, vibrationresistance, impact resistance and structural electromagnetic compatibility.

Description

technical field [0001] The invention relates to the field of electronic equipment such as communication or navigation, in particular to a reinforced and sealed chassis based on the MTCA standard and an assembly method thereof. Background technique [0002] MTCA is MircoTCA, and its architecture is similar to a simplified version of ATCA. It is compatible with ATCA's high performance, high bandwidth, and AMC's flexibility, creating a very high level of integration, while greatly reducing the cost, reducing the system space and scale, and the design without the carrier board is more convenient for the AMC module. use. So that it can well meet the application requirements of low-end communications, industry, military, medical, multimedia and other fields. [0003] Table 1 Terms and Definitions [0004] [0005] The existing traditional MTCA chassis structure, such as figure 1 shown. The picture shows a standard, MTCA-compliant, 19-inch rackmount 3U subrack. The chassis...

AI Technical Summary

Problems solved by technology

There are many types and quantities of parts that make up the box, usually dozens of parts, and the number of fasteners required is relatively large, making assembly difficult and time-consuming;

[0015] When the chassis needs maintenance or repair, it is difficult to disassemble and takes a long time

[0016] 2. Weaker three defense capabilities (anti-salt spray, anti-mold, anti-humidity and heat)

[0017] The chassis is not a sealed chassis. The external ambient air is in a state of communication with the various circuit parts inside the chassis. The printed boards and components are exposed to the air in the external environment. The external air will directly contact the printed boards and electronic components. In most cases, boards and electronic components will be sprayed with anti-mildew paint, but in harsh environments such as equipment on sea ships, as the use time of the chassis increases, some of the three anti-paints will fall off, and the surface of the peeled part is vulnerable to mold, Salt spray or hot and humid corrosion;

[0018] Generally, the inner surface of the chassis is only treated with surface treatment, such as electroplating, etc., without painting, the inner surface of the chassis is easily corroded by mold, salt spray or damp heat

[0019] 3. Weak cooling capacity

[0025] 4. Weak anti-vibration and anti-shock ability

This produces a serious coupling effect in the printed board of the AMC module, which will increase the stress level in the printed board and reduce its fatigue life

[0028] 5. Weak structural electromagnetic compatibility

[0029] In the traditional chassis design, on the one hand, the chassis is assembled by splicing and screwing multiple boards, and there will be electromagnetic leakage at the splicing places; there are cooling ventilation holes on the outer surface of the chassis, and the ventilation holes are connected with the printed boards and electronic components in each AMC module inside the chassis. The components are connected, resulting in electromagnetic leakage, and the electromagnetic compatibility of the whole machine structure is weak

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