Multilayer Ceramic Electronic Components
A technology of electronic components and ceramics, applied in the field of laminated ceramic electronic components, to achieve the effect of suppressing surface discharge and heat generation
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no. 1 approach
[0077] The laminated ceramic electronic component according to the first embodiment of the present invention will be described. figure 1 It is an external perspective view showing an example of the laminated ceramic electronic component according to the first embodiment of the present invention. figure 2 yes figure 1 The cross-sectional view at the line II-II, image 3 yes figure 1 The sectional view at the line III-III. Figure 4 yes figure 1 A sectional view at line IV-IV of the, Figure 5 yes figure 1 Top view of the stacked ceramic electronic component shown.
[0078] Such as figure 1 As shown, the laminated ceramic electronic component 10A includes, for example, an electronic component main body 12 , a first metal terminal 40A and a second metal terminal 40B composed of two metal terminals, and an exterior material 15 . The electronic component main body 12 and the first metal terminal 40A, and the electronic component main body 12 and the second metal terminal 4...
no. 2 approach
[0176] A laminated ceramic electronic component according to a second embodiment of the present invention will be described. Figure 7 It is a plan view showing an example of the laminated ceramic electronic component according to the second embodiment of the present invention. Figure 8 yes Figure 7 The sectional view at the line VIII-VIII.
[0177] In addition, the laminated ceramic electronic component 10B of 2nd Embodiment is obtained by arranging two electronic component main bodies 12 demonstrated in 1st Embodiment in parallel, and spaced apart from each other. Therefore, the same reference numerals are attached to the same parts as those of the electronic component main body 12, and description thereof will be omitted.
[0178] The two electronic component main bodies 12 are arranged such that the first main surfaces 14a, the second main surfaces 14b, or the first main surfaces 14a and the second main surfaces 14b face each other with a gap ensured. At this time, the ...
no. 3 approach
[0208] A laminated ceramic electronic component according to a third embodiment of the present invention will be described. Figure 11 It is a plan view showing an example of the laminated ceramic electronic component according to the third embodiment of the present invention. Figure 12 yes Figure 11 Sectional view at line XII-XII.
[0209] In the laminated ceramic electronic component 10C of the third embodiment, the electronic component main bodies 12 described in the first embodiment are arranged in two rows and spaced apart from each other. Therefore, the same reference numerals are attached to the same parts as those of the electronic component main body 12, and description thereof will be omitted.
[0210] The two electronic component main bodies 12 are disposed so that the first end surfaces 14e, the second end surfaces 14f, or the first end surfaces 14e and the second end surfaces 14f face each other with a gap ensured.
[0211] In addition, although 3rd Embodimen...
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Abstract
Description
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Application Information
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