A method of making alloy plate metal resistors for electronic products

Abstract

The invention discloses a method for manufacturing an alloy plate metal resistor for an electronic product. The method comprises the following steps that: (1) an array region comprising a plurality ofimages matched with the shape of the resistor is manufactured on an alloy plate with a set size by adopting a lithography process; (2) the image array region is etched until the thickness of the alloy plate is adaptive to a target resistor resistance value, so that an alloy resistor body circuit can be formed; (3) a front electrode and a back electrode are sequentially manufactured on the front surface and back surface of each alloy resistor body through the lithography process and an electroplating method; (4) an insulating protective film is manufactured in a non-electrode region, and a laser code is manufactured on the insulating protective film; (5) the resistor in the array region is cut off; and (6) a plurality of layers of metal films are sequentially deposited on the surface of corresponding electrode regions in the resistor. According to the manufacturing method, the precise alloy resistor circuit is obtained through the lithography manufacturing process; the manufactured product has the characteristics of high precision, high power and small size. The method has the advantages of simplicity and high efficiency.

Description

technical field [0001] The invention belongs to the field of resistors of electronic components, and in particular relates to a method for manufacturing alloy plate metal resistors used in electronic products. Background technique [0002] With the advancement of science and technology, the development of the times and the continuous improvement of people's requirements for various electronic products, resistors with reliable performance, stable process and applicable to various working environments also present a diversified development trend in response to the special needs of electronic products. Among them, the market demand for high-precision and high-power resistors is also constantly developing, especially the market's demand for miniaturized, high-power and high-precision resistors, which has prompted resistor manufacturers to develop miniaturized high-power resistors, which can be widely used in Miniaturized high-power high-precision resistors in products such as au...

AI Technical Summary

Problems solved by technology

[0003] Faced with the development trend of increasingly miniaturized terminal application equipment, the structural design of ordinary alloy chip resistors cannot get rid of the constraints of the ceramic substrate skeleton, making resistor products larger in size, lower in precision, and far less heat-dissipating than metals. Internal stress causes a shell-like fracture mode, and the use of brittle and hard (usually less than 3mm) ceramic substrates as the carrier has poor impact resistance and is easy to bend and break, resulting in failure of the entire circuit system, and alloy chip resistors The electrical performance of the product is greatly affected by temperature, and even when it exceeds 150°C, the product failure power is low and easy to burn

Alloy chip resistors usually need to adjust the thickness of the alloy foil to increase power, but the existing process cannot be etched cleanly, resulting in unstable product precision distribution, lower yield, low reliability, unstable electrical performance, and repeated corrections are required to complete multiple Secondary coating molding has high requirements on product quality and assembly process, and the need to use silver and other precious metals as electrodes leads to high overall production costs

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