A sintered printed circuit board dielectric hole blocking process and structure

Abstract

The invention discloses a dielectric hole plugging process of a sintered printed board circuit board, which comprises the following steps: S1, during design of a printed circuit board, through groovesare formed in the periphery of a chip hole opening position, and at least four dielectric reinforcing ribs are reserved in the circumferential direction of the chip hole opening position; S2, the copper foil on the surface of the medium in the top layer hole of the chip hole of the printed circuit board is reserved and a solder mask layer is arranged on the copper foil; and S3, the copper foil isremoved from the bottom layer hole of the chip hole of the printed circuit board. The invention also discloses a structure obtained by adopting the process. The process and the structure have the beneficial effects that the skill requirements on workers are reduced; no void around the hole, more than 90% of the mounting surface of the chip in the hole is ensured not to be polluted by solder, thethermal conductivity under high power is ensured, the impedance of a radio frequency signal is ensured, electrical parameters are ensured not to be influenced, the cutting force of the chip is ensured, the risk of product failure is reduced, the production efficiency is greatly improved, the bonding tension is improved, and the reliability of the product is improved.

Description

technical field [0001] The invention relates to the technical field of microwave assembly technology, in particular to a sintered printed circuit board medium hole plugging technology and structure. Background technique [0002] At present, in the micro-assembly industry, when the printed board is sintered, the hole plugging process of the chip adopts epoxy glue, toothpaste and paper to plug the hole, or adopts the non-blocking process. [0003] When epoxy glue, toothpaste and paper are used to plug holes, the process flow of the printed board sintering process is as follows: figure 1 As shown, the printed board first puts the soldering piece, and then puts epoxy glue or toothpaste in the chip hole, and then pads the paper and installs the pressing tool; in the process of pressing the block, epoxy glue or toothpaste Because it is a fluid body, the epoxy glue or toothpaste flows to the gap between the bottom surface of the printed board and the cavity due to the pressure of ...

AI Technical Summary

Problems solved by technology

These problems directly affect the post-process wire bonding strength, chip bonding strength, grounding of printed boards, high-power heat dissipation of printed boards and product electrical parameters, affecting product reliability

[0004] When the non-blocking process is used, after the solder is liquefied at high temperature, a lot of solder will accumulate in the chip hole under the pressure of the briquetting tool. It is difficult and time-consuming to manually remove the excess solder in the subsequent process, and the technical requirements for the workers are very high, which is not conducive to Production efficiency and chip bonding and sintering strength, affecting product reliability

Images