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Energy-saving LED lighting device and manufacturing method thereof

An LED lighting, energy-saving technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as thermal matching imbalance, disconnection of welding wires, water vapor invasion, etc. rate effect

Active Publication Date: 2020-12-25
德润规划设计院(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the problem of unbalanced thermal matching, the LED chip 21 and fluorescent resin 24 are easily peeled off from the heat dissipation substrate 20, resulting in the invasion of water vapor
Moreover, the fluorescent resin 24 is mostly relatively cheap materials such as epoxy resin and silicone resin, which are all thermal expansion materials. When heated, they have a force F that stretches outwards, see Image 6 (b), the existence of this force F will lead to the disconnection of the connection between the bonding wire 23 and the LED chip 21, resulting in package failure

Method used

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  • Energy-saving LED lighting device and manufacturing method thereof
  • Energy-saving LED lighting device and manufacturing method thereof
  • Energy-saving LED lighting device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0033] see figure 1 (a), which includes an LED chip 2 fixed on a substrate 1 through an adhesive layer 3, the LED chip is a gallium nitride-based LED chip, or a mini-LED chip; the substrate 1 is a heat dissipation substrate, such as LTCC substrates, DBC substrates, etc., have circuit layers on them. The adhesive layer 3 has permanent adhesiveness, and it can be selected as a high polymer adhesive material, which can be an adhesive material commonly used in the field, and will not be repeated here.

[0034] The back of the LED chip 2 is attached to the circuit layer through the adhesive layer 3; the light emitting surface of the LED chip 2 faces upward, and the edge of the light emitting surface has electrodes (not shown), and the electrodes are soldered The wire 4 is electrically connected to the circuit layer. The bonding wires 4 are copper wires, gold wires, silver wires and the like. The bonding wire 4 is wire-bonded through a wire bonding tool, which may be a wedge-sha...

no. 2 example

[0039] In the first embodiment, since the overall structure on the substrate exhibits shrinkage stress, the heat shrinkable material 5 presses down the LED chip 2 and is bonded to the substrate 1. If the heat shrinkable material 5 and the substrate If the bonding force is too small, peeling will easily occur. For this, in this example, see figure 2 (a), on the substrate 1 , grooves 7 are formed around the LED chip 2 , and the grooves 7 may be two or four discrete, or may be a ring structure surrounding the LED chip 2 . see figure 2 (b), wherein, the heat-shrinkable material 5 fills a part of the groove 7, and the fluorescent resin 6 fills other parts of the groove 7, which can increase the bonding between the fluorescent resin and the heat-shrinkable material and the substrate force, and improve the reliability of the thermal shrinkage material 5 to press the LED chip 2 .

no. 3 example

[0041] see image 3 (a), in this embodiment, the heat-shrinkable material 5 completely seals the side of the LED chip 2 , and its pressing force is greater. And, a part of the surface of the heat-shrinkable material 5 and the groove of the light-emitting surface form a recess, and the fluorescent resin 6 fills the recess and forms a raised arc surface (ie, a convex structure) due to surface tension. The curved surface can increase the light output. see image 3 (b), at this time, the fluorescent resin 6 only covers a part of the heat shrinkable material. Of course, in this embodiment, for example, the groove 7 of the second embodiment may also be provided. At this time, the groove 7 is completely filled with the heat shrinkable material 5 .

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Abstract

The present invention provides an energy-saving LED lighting device and a manufacturing method thereof. The energy-saving LED lighting device adopts a thermal shrinkage material to avoid disconnectionof a bonding wire and stripping of an LED chip, fluorescent resin and a heat dissipation substrate, so that the improvement of the packaging yield can be achieved, and the light extraction rate can be improved; and the manufacturing method disclosed by the invention is extremely simple and lower in manufacturing cost.

Description

technical field [0001] The invention relates to the field of LED lighting packaging, in particular to an energy-saving LED lighting device and a manufacturing method thereof. Background technique [0002] Most of the existing LED packaging structures are COB structures, that is, chip-on-board structures, which usually require consideration of heat dissipation. see Image 6 (a), the LED chip 21 is fixed on the heat dissipation substrate 20 through the adhesive layer 22, and the LED chip 21 is electrically connected to the circuit layer of the heat dissipation substrate 20 through the bonding wire 23 to realize power supply, and finally uses the fluorescent resin 24 to carry out Seals and regulates color temperature. However, due to the problem of unbalanced thermal matching, the LED chip 21 and the fluorescent resin 24 are easily peeled off from the heat dissipation substrate 20, resulting in the invasion of water vapor. Moreover, the fluorescent resin 24 is mostly relative...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56
CPCH01L33/56H01L2933/005
Inventor 侯立东
Owner 德润规划设计院(深圳)有限公司