High-temperature-resistant modified acrylate pressure-sensitive adhesive and preparation method thereof

A technology of acrylate and pressure-sensitive adhesives, which is applied in the direction of adhesives, ester copolymer adhesives, adhesive types, etc., can solve the problems of high-temperature peeling force of pressure-sensitive adhesives, high production costs, and difficult control, etc., to achieve Solve the effect of high production cost, high production efficiency, simple operation and easy control

Active Publication Date: 2020-01-17
四川羽玺新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof. The preparation raw materials are easy to obtain, the production efficiency is high, and the pressure-sensitive adhesive can be prepared quickly, which effectively solves the problem of High production cost, difficult operation and difficult control, and high-temperature peeling force of pressure-sensitive adhesives

Method used

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  • High-temperature-resistant modified acrylate pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof, the preparation method comprising the following steps:

[0024] (1) Add 25.5g of butyl acrylate, 0.9g of octadecyl acrylate, 0.9g of isobornyl acrylate, 0.9g of acrylic acid, 0.9g of 2-hydroxybutyl acrylate, and trans-2-(4-biphenyl) 0.9g of vinylboronic acid, 0.075g of benzoyl peroxide, 55g of ethyl acetate, and 15g of toluene were mixed uniformly, and reacted at 78°C for 1 hour to obtain mixture 1;

[0025] (2) 25.5g of butyl acrylate, 0.9g of octadecyl acrylate, 0.9g of isobornyl acrylate, 0.9g of acrylic acid, 0.9g of 2-hydroxybutyl acrylate, trans-2-(4-biphenyl)ethylene 0.9 g of base boronic acid, 0.03 g of initiator benzoyl peroxide, and 40 g of ethyl acetate were mixed uniformly and added to a constant liquid funnel, uniformly added dropwise into the obtained mixture 1 within 1 hour, and kept for 30 minutes to obtain mixture 2;

[0026] (3) Add 34g of buty...

Embodiment 2

[0028] A high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof, the preparation method comprising the following steps:

[0029] (1) Add 24.9g of butyl acrylate, 0.9g of lauryl acrylate, 1.2g of vinyl acetate, 0.9g of acrylic acid, 1.2g of 2-hydroxybutyl acrylate, and trans-2-(4-biphenyl)vinyl 0.9 g of boric acid, 0.075 g of benzoyl peroxide initiator, 55 g of ethyl acetate, and 15 g of toluene were mixed uniformly, and reacted at 80° C. for 1 h to obtain mixture 1;

[0030] (2) Add 24.9g of butyl acrylate, 0.9g of lauryl acrylate, 1.2g of vinyl acetate, 0.9g of acrylic acid, 1.2g of 2-hydroxybutyl acrylate, and trans-2-(4-biphenyl)vinylboronic acid 0.9g, initiator benzoyl peroxide 0.03g, and ethyl acetate 40g were mixed evenly and added to a constant liquid funnel, uniformly added dropwise into the obtained mixture 1 within 1 hour, and kept for 30 minutes to obtain mixture 2;

[0031] (3) Add 33.2g of butyl acrylate, 1.2g of...

Embodiment 3

[0033] A high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof, the preparation method comprising the following steps:

[0034] (1) Add 24.3g of butyl acrylate, 0.9g of octadecyl acrylate, 0.9g of vinyl acetate, 1.8g of methacrylic acid, 1.2g of 2-hydroxybutyl acrylate, and trans-2-(4-biphenyl ) 0.9 g of vinylboronic acid, 0.075 g of benzoyl peroxide initiator, 55 g of ethyl acetate, and 15 g of toluene were uniformly mixed, and reacted at 82° C. for 1 h to obtain mixture 1;

[0035] (2) 24.3g of butyl acrylate, 0.9g of octadecyl acrylate, 0.9g of vinyl acetate, 0.9g of methacrylic acid, 1.2g of 2-hydroxybutyl acrylate, trans-2-(4-biphenyl) Mix 0.9 g of vinyl boronic acid, 0.03 g of benzoyl peroxide as an initiator, and 40 g of ethyl acetate, and add them into a constant liquid funnel, and drop them evenly into the obtained mixture 1 within 1 hour, and keep the reaction for 30 minutes to obtain mixture 2;

[0036] (3) Add 32...

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PUM

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Abstract

The invention discloses a high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof, wherein the high-temperature-resistant modified acrylate pressure-sensitive adhesive comprises, by weight, 75-93 parts of a soft monomer, 3-8 parts of a hard monomer, 3-8 parts of a functional monomer, 2-10 parts of an organic boric acid modified monomer, 0.1-0.4 part of an initiator and 100-200 parts of a solvent. The invention further provides a preparation method of the high-temperature-resistant modified acrylate pressure-sensitive adhesive. According to theinvention, the preparation raw materials are easy to obtain, the production efficiency is high, the pressure-sensitive adhesive can be rapidly prepared, and the problems that the production cost is high, the operation is difficult and not easy to control, and the high-temperature stripping force of the pressure-sensitive adhesive is increased are effectively solved.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a high-temperature-resistant modified acrylate pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] Pressure-sensitive adhesive is an adhesive that is sensitive to external pressure. It only needs to provide a slight pressure to make it stick to the object. It is suitable for various fields, such as electronic machinery manufacturing, automobile Manufacturing and daily necessities, among which pressure-sensitive adhesives are widely used in consumer electronics fields such as mobile phones and car displays, which require that the pressure-sensitive adhesives used in them are resistant to high temperatures without residual glue, and the peeling force climbs less than 1 times after high temperatures. However, the raw materials for the preparation of existing pressure-sensitive adhesives are expensive, which makes the production cost relative...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/18C08F220/06C08F220/20C08F230/06C08F218/08C09J133/08
CPCC08F220/18C09J143/00
Inventor 许显成陈善勇郑婷巫柯代申强陈仁秀
Owner 四川羽玺新材料股份有限公司
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