Heat exchange equipment and semiconductor processing equipment
A heat exchange device, heat exchanger technology, applied in heat exchange equipment, lighting and heating equipment, semiconductor/solid-state device manufacturing, etc., can solve the problems of small area, limited heat exchange capacity of heat exchanger, limited cooling capacity, etc. , to achieve the effect of increasing residence time, improving heat exchange capacity and heat exchange effect, and improving heat exchange capacity
Active Publication Date: 2021-09-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0004] However, in the existing heat exchanger, the uniform flow device is arranged on the outside of the air outlet, so that the relative distance between the air inlet and the air outlet is relatively short, so that the air flows through the heat between the air inlet and the air outlet. The area of the exchange component is small, which limits the heat exchange capacity of the heat exchanger. Even if the heat exchanger has a relatively high efficiency, its overall cooling capacity is also limited
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[0036] In order for those skilled in the art to better understand the technical solution of the present invention, the heat exchange device and semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0037] Such as Figure 1-Figure 7 As shown, this embodiment provides a heat exchange device, including a heat exchanger body 10, a flow guide assembly and an air extraction assembly; The front end of the heat exchanger main body 10 is used to guide the untreated hot air flow that is about to flow into the heat exchanger main body 10; The treated air flow is discharged to the air outlet; the air extraction assembly is arranged at the front end of the air outlet 14 of the heat exchanger main body 10; the inside of the heat exchanger main body 10 contains a plurality of heat exchange areas, and the air outlet 14 contains a plurality of sub-air outlets 14; Each heat exchange area is provid...
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The invention provides a heat exchange device and semiconductor processing equipment, including a heat exchanger body, a flow guide assembly and an air extraction assembly; wherein, the front of the heat exchanger main body contains an air inlet, and the flow guide assembly is arranged at the front end of the air inlet , which is used to guide the untreated hot air flow that is about to flow into the heat exchanger body; the air extraction component has an air outlet; the side of the heat exchanger body has an air outlet, which is used to discharge the air stream treated by the heat exchanger body to Air outlet; the air extraction assembly is arranged at the front end of the air outlet of the heat exchanger main body; the interior of the heat exchanger main body contains multiple heat exchange areas, and the air outlet contains multiple sub-air outlets; each heat exchange area is connected to the sub-air outlets one by one corresponding settings. The heat exchange device and semiconductor processing equipment provided by the invention can improve heat exchange capacity and heat exchange effect.
Description
technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a heat exchange device and semiconductor processing equipment. Background technique [0002] As the front-end process equipment in the semiconductor manufacturing process, the vertical furnace heat treatment equipment mainly performs heat treatment processes such as oxide film, annealing and low pressure chemical vapor deposition (Low Pressure Chemical Vapor Deposition, LPCVD). High, the components inside the vertical furnace heat treatment equipment will withstand higher temperatures. In order to protect the internal components of the equipment, it is necessary to quickly and effectively reduce the internal temperature of the vertical furnace heat treatment equipment to a safe temperature range. [0003] At present, a heat exchanger is usually installed inside the vertical furnace heat treatment equipment. The high-temperature air enters the heat exchanger from t...
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IPC IPC(8): F28D21/00F28F1/10F28F9/22H01L21/67
CPCF28D21/00F28F1/10F28F9/22H01L21/67109Y02P70/50
Inventor 宋新丰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD