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Negative resistance type GaN pressure sensor and preparation method thereof

A technology of pressure sensor and negative resistance, which is applied in the field of negative resistance GaN pressure sensor and its preparation, which can solve the problems of distortion, slow pressure response, and small capacitance and piezoelectric variation coefficient, and achieve low voltage, fast response speed, and high response The effect of sensitivity

Pending Publication Date: 2020-01-24
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in these methods, due to the small piezoelectric variation coefficient of concentration, mobility and capacitance, the minimum applied pressure is limited, and there are nonlinear and hysteresis effects of pressure, resulting in slow pressure response and distortion.

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  • Negative resistance type GaN pressure sensor and preparation method thereof
  • Negative resistance type GaN pressure sensor and preparation method thereof
  • Negative resistance type GaN pressure sensor and preparation method thereof

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Embodiment Construction

[0033] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] This embodiment provides a novel gate-controlled PIN structure GaN ultraviolet detector and its preparation method. The profile of the device is as follows: figure 1 As shown, it consists of Si substrate 1, GaN buffer layer 2, n-type GaN layer 3, AlGaN layer 4, GaN layer 5, AlGaN layer 6, n-type GaN layer 7, aluminum oxide passivation layer 8, upper metal electrode 9 and the lower metal electrode 10.

[0035] Such as figure 1 As shown in a, in the double barrier AlGaN / GaN / AlGaN quantum well structure,...

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Abstract

The invention discloses a negative resistance type GaN pressure sensor and a preparation method thereof. The preparation method comprises the following steps: 1) sequentially growing a GaN buffer layer and an n-type GaN layer on a Si substrate; 2) growing a double-barrier AlGaN / GaN / AlGaN quantum well on the n-type GaN layer; 3) growing the n-type GaN layer on the double-barrier AlGaN / GaN / AlGaN quantum well; 4) selectively etching the epitaxial layer material to form an etch table top and a step; 5) depositing a passivation layer on the table top and the step; 6) etching the passivation layer to form an electrode hole and depositing a metal electrode; and 7) selectively etching the Si substrate to form an etching groove. Firstly, the resonant tunneling effect is utilized to regulate carriertransport process and negative resistance effect in the quantum well; and secondly, the piezoelectric polarization effect of the AlGaN / GaN heterojunction is utilized and the polarized electric fieldis changed by the external pressure so that the energy level in the quantum well is changed, the tunneling efficiency of carriers in the quantum well is controlled and the output current decreases rapidly, i.e. the negative resistance effect occurs under the external pressure so as to show the extremely high response sensitivity.

Description

technical field [0001] The invention relates to the field of pressure sensors, in particular to a negative resistance GaN pressure sensor and a preparation method thereof. Background technique [0002] Pressure sensor is currently the most commonly used sensor in the field of industrial applications. It is widely used in various industrial control environments, involving railway transportation, aerospace, military industry, water conservancy and hydropower, intelligent buildings, electric power, machine tools, ships and many other industries. [0003] Traditional semiconductor pressure sensors realize the output of electrical signals by changing the carrier concentration, mobility or capacitance under pressure, thereby realizing pressure sensing. However, in these methods, due to the small piezoelectric variation coefficient of concentration, mobility, and capacitance, the minimum applied pressure is limited, and there are nonlinear and hysteresis effects of pressure, result...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/113H01L41/083H01L41/18H01L41/27H10N30/30H10N30/05H10N30/50H10N30/85
CPCH10N30/50H10N30/85H10N30/302H10N30/05
Inventor 张伟汤乃云叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA