Embedded circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, laminated printed circuit boards, printed circuits, etc., can solve the problems of occupying circuit layout space, occupied by solder paste, unfavorable high functionalization of circuit boards, etc. Layout, the effect of reducing thickness
Active Publication Date: 2021-05-28
AVARY HLDG (SHENZHEN) CO LTD +1
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- Application Information
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Problems solved by technology
However, when the existing embedding technology is used to manufacture circuit boards, the embedded components are mounted on the surface of the circuit, occupying the space of the circuit layout, which is not conducive to the high functionality of the circuit board, and the bottom of the component needs to be soldered with solder paste. Occupies a certain thickness, which is not conducive to the thinning of circuit boards
Method used
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0020] Some embodiments of the present invention will be described in detail below in conju...
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A method for manufacturing an embedded circuit board, comprising the following steps: providing a flexible circuit board provided with at least one mounting groove, the flexible circuit board comprising a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and The two protective layers are respectively located on the two outermost layers of the flexible circuit board, the installation groove penetrates the flexible circuit board, the base layer and the first conductive circuit layer protrude from the installation groove; a jig containing components is provided, and the flexible circuit board is placed In the jig, the component is installed in the installation groove, and the side of the component is against the first conductive circuit layer; a conductive material is set at the gap between the component and the first conductive circuit layer, and cured; the jig is removed; Colloids are respectively placed on the outer sides of the two protective layers, and substrates are respectively placed on the outer sides of the colloids; and the substrate, the colloids and the flexible circuit board are pressed together. The invention also provides an embedded circuit board.
Description
technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to an embedded circuit board and a manufacturing method thereof. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and the demand for miniaturization, multi-function and high performance is getting higher and higher. As the main component of electronic products, circuit boards occupy a large space of electronic products, so the volume of circuit boards affects the volume of electronic products to a large extent. By embedding electronic components (such as resistors, capacitors, etc.) The interior of the circuit substrate is conducive to reducing the overall thickness of the circuit board, thereby reducing the thickness of electronic products. However, when the existing embedding technology is used to manufacture circuit boards, the embedded components are mounted on the surface of the circuit, occupying th...
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IPC IPC(8): H05K1/18H05K1/11H05K3/32
CPCH05K1/118H05K1/186H05K3/321H05K3/326H05K3/4602H05K3/4691H05K2201/09127H05K2201/10636H05K2203/063Y02P70/50H05K1/185H05K1/189H05K3/0058H05K3/007H05K3/3452H05K3/4697
Inventor 侯宁李彪钟浩文王铭慧
Owner AVARY HLDG (SHENZHEN) CO LTD