Copper-column-added SSD memory chip packaging structure and packaging method thereof

Abstract

The invention discloses a copper-column-added SSD memory chip packaging structure and a packaging method thereof. The packaging structure comprises a substrate serving as a carrier, a plurality of layers of memory chips are attached to the upper surface of the substrate, and each layer of memory chip is bonded with the substrate through bonding wires. A control chip is attached to the lower surface of the substrate, and the control chip is bonded with the substrate through bonding wires. Signal interaction between the memory chips and the control chip is realized through a welding circuit on the substrate. The lower surface of the substrate, the control chip and the bonding wires are packaged in the lower part of the substrate through a first plastic package body. Copper columns are arranged at the periphery of the control chip. One end of each copper column is jointed with the lower surface of the substrate, and the other end of each copper column extends to the outside of the first plastic package body to serve as a welding pin. The upper surface of the substrate, the memory chips and the bonding wires are packaged in the upper part of the substrate through a second plastic package body. The memory chip packaging method is simple in operation, effective heat dissipation can be achieved, and the size of the packaging structure can be reduced.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a copper column-added SSD storage chip packaging structure and a packaging method thereof. Background technique [0002] With the continuous development of science and technology, people's demand for consumer electronics products is getting higher and higher. The memory chip in electronic products is a key core component. The packaging requirements for this chip are also getting higher and higher, and the size is small. Large capacity has become a trend. The traditional SSD package has a large chip area, poor heat dissipation, and the package size is difficult to meet customer requirements. Contents of the invention [0003] The object of the present invention is to provide a copper column-added SSD memory chip packaging structure and a packaging method thereof to solve the problems of large packaging area and poor heat dissipation of the storage chip in the above-mentioned prior...

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Problems solved by technology

[0003] The object of the present invention is to provide a copper column-added SSD memory chip packaging structure and a packaging method thereof to solve the problems of large packaging area and poor heat dissipation of the storage chip in the above-mentioned prior art, which can realize effective heat dissipation, It can also reduce the volume of the packaging structure, and the packaging process is easy to operate, thereby improving chip quality and reducing processing costs

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