A chip heat dissipation package structure
A packaging structure and chip heat dissipation technology, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of inconspicuous air cooling heat dissipation effect and low heat dissipation efficiency, and achieve obvious heat dissipation effect and high heat dissipation efficiency , Improve the effect of cooling efficiency
Active Publication Date: 2021-10-22
NAT CENT FOR ADVANCED PACKAGING CO LTD
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Problems solved by technology
[0005] Therefore, the technical problem to be solved by the present invention is to overcome the inconspicuous heat dissipation effect and low heat dissipation efficiency of the air cooling technology in the prior art, thereby providing a chip heat dissipation packaging structure
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Embodiment 1
[0036] like figure 1 , The present embodiment relates to a heat dissipation chip package structure includes a substrate 1, a semiconductor chip 3 and the cooling micro-channel chip 4.
[0037] Operation of the chip 2 placed on the substrate 1, the chip 2 is the work to heat the chip, a semiconductor chip 3 is mounted on a cooling operation of the chip 2, and the semiconductor chip 3 is in the cooling of the substrate opposite the side on the operation of the chip 21, a semiconductor cooling chip 3 for operation of the chip 2 for heat dissipation. The micro-channel chip 4 is mounted on the semiconductor chip 3 cooling, the micro-channel chip 4 of the semiconductor chip and the refrigerant on the side opposite the working chip 2, the micro-channel chip 4 for cooling the semiconductor chip 3 is dissipated 3.
[0038] Wherein, in order to enhance the cooling effect of the semiconductor chip 3 and the cooling micro-channel chip 4, on the semiconductor chip 3 and the cooling micro-chann...
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The invention relates to the field of chip packaging, in particular to a chip heat dissipation packaging structure, comprising: a substrate loaded with a working chip; a semiconductor cooling chip installed on the working chip for dissipating heat from the working chip; and a semiconductor cooling chip installed on the working chip Above, the microfluidic channel chip used to dissipate heat from semiconductor cooling chips. In the present invention, a semiconductor cooling chip is arranged on the working chip, so that the heat dissipated by the working chip can be directly and actively dissipated, and then a micro-channel chip is arranged on the semiconductor cooling chip, and the semiconductor cooling chip is dissipated through the micro-channel chip, thereby The heat dissipation efficiency of the working chip is higher, and the heat dissipation effect is obvious. A thermoelectric conversion layer is also installed between the working chip and the substrate. The thermoelectric conversion layer is used to convert the heat of the working chip into electrical energy and drive the semiconductor cooling chip or the microchannel chip to work, avoiding the setting of an external power supply and saving energy.
Description
Technical field [0001] The present invention relates to a chip package, and in particular relates to a chip package structure of heat dissipation. Background technique [0002] With the increased integration and functionality of electronic components, electronic products and electronic equipment in some devices also increases the heat flux density, cooling technology to increasingly high demands. [0003] The most widely used air-cooled cooling technology is technology, refers to a cooling air cooling by way of the flow of air will take away the heat generated by electronic components, comprising natural and forced convection. Natural convection air cooling techniques using the apparatus main heat conduction of each component and the void casing, convection and radiation to achieve the purpose of cooling and heat dissipation. Because of its natural convection cooling and heat dissipation capacity is very limited, so that a smaller amount of heat is often used to cool electronic c...
Claims
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IPC IPC(8): H01L23/38H01L23/473H01L23/367H01L23/373
CPCH01L23/3677H01L23/373H01L23/38H01L23/473H01L2224/16225H01L2224/73253H01L2924/15192
Inventor 曹立强徐成孙鹏
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD