An intelligent perforation method for laser cutting and laser cutting equipment

Abstract

The invention discloses an intelligent perforation method for laser cutting and laser cutting equipment. The method includes: receiving interface parameters input by a user, and obtaining position information of a cutting head unit; driving the cutting head unit to a position to be perforated; according to The preset first logical rule performs logical operation on the interface parameters to obtain the perforation parameters of the first perforation; according to the perforation parameters, the drive unit can be driven; according to the perforation parameters of the previous perforation, and according to the preset second logic The rule is to obtain the punching parameters for the next punching; judge whether the punching parameters of the next punching meet the end condition, if it is finished, otherwise, make the driving unit perform the driving operation according to the punching parameters; until the obtained punching parameters meet the end condition. The above method can reduce the interface setting time of the operator, improve the perforation efficiency and improve the processing stability at the same time.

Description

technical field [0001] The invention relates to the technical field of laser cutting, in particular to an intelligent perforation method for laser cutting and laser cutting equipment. Background technique [0002] During the cutting process of laser equipment, each graphic element must be perforated before cutting, and the perforation time takes up a large part of the entire cutting process. With the increasing demand for high-power thick plate processing, there are more requirements and optimizations for the performance and efficiency of piercing. At the same time, the perforation factor has a great influence on the cutting effect, and even directly determines whether the cutting workpiece can be qualified. [0003] At present, the perforation process commonly used in the market includes direct perforation for thin plates; segmental perforation and progressive perforation for medium and thick plates; and three-stage perforation for thick plates. Although these processes c...

AI Technical Summary

Problems solved by technology

Although these processes can meet certain processing requirements, there are many parameters to be set on the operation interface, and there are also many data to be set. The skill level and proficiency of the debugger will affect the final use effect and stability.

As the laser processing power increases, the cutting material becomes thicker, and the debugging process becomes more and more complicated, requiring debugging personnel to have higher professional ability

In specific applications, the commissioning of the existing perforation process takes a long time and requires high costs

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