Novel EB curing nitrogen gas protection device

Abstract

The invention discloses a novel EB curing nitrogen gas protection device. The novel EB curing nitrogen gas protection device comprises an emitting box capable of emitting an electron beam, a coating curing chamber is arranged on the emitting box, a steel roller for feeding a substrate into the coating curing chamber is arranged in the coating curing chamber, an electron beam entry port for allowing the electron beam to be emitted in and to cure the coating on the substrate is arranged on the coating curing chamber, a main nitrogen gas port connected with a nitrogen gas supply device for filling nitrogen gas into the part between the coating curing chamber and the steel roller is arranged at an electron beam inlet, nitrogen gas supplement ports communicating with the coating curing chamberare formed in the parts, close to the end part of the coating curing chamber, of the coating curing chamber, and nozzles for filling the nitrogen gas into the part between the coating curing chamber and the steel roller is arranged on the nitrogen gas supplement ports. The high-pressure and high-flow nitrogen gas forms a high-speed wind blade through the nozzles, and an air layer attached to the surface of the coating substrate or the surface of the printing substrate can be effectively dispersed; and a nitrogen gas curtain formed by the high-speed wind blade can effectively prevent outside air from entering the coating curing chamber, so that the oxygen concentration in the EB curing area is lower than the EB curing requirement.

Description

【Technical field】 [0001] The invention relates to a novel EB curing nitrogen protective device. 【Background technique】 [0002] EB curing is the process of inducing the cross-linking and curing of the system through the radiation of high-energy electron beams generated by the electron accelerator to realize the curing of the coating. During the EB curing process, if there is oxygen in the curing area, an oxygen inhibition reaction will occur, and the ink or coating surface will not be completely cured. Therefore, EB curing usually requires the protection of inert gas. [0003] At present, nitrogen protection is generally used in the industry. Nitrogen is filled in the semi-closed EB curing area to prevent oxygen. However, when the coated or printed substrate enters the EB curing area at high speed, the outside air will be on the surface of the substrate. An air layer is formed and attached to the surface of the substrate to enter the EB curing area, which affects the EB cu...

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Problems solved by technology

[0003] At present, nitrogen protection is generally used in the industry. Nitrogen is filled in the semi-closed EB curing area to prevent oxygen. However, when the coated or printed substrate enters the EB curing area at high speed, the outside air will be on the surface of the substrate. Form an air layer and attach to the surface of the substrate to enter the EB curing area, affecting the EB curing effect, and the faster the equipment runs, the worse the EB curing effect

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