Micro-channel vapor chamber with recess structure

Abstract

The invention discloses a micro-channel vapor chamber with a recess structure. The micro-channel vapor chamber comprises a bottom plate, a capillary core and a cover plate, a concave cavity is formedin the upper surface of the bottom plate, the capillary core is arranged in the concave cavity, a micro-channel structure is machined on the upper surface of the cover plate, concave cavity structuresare arranged on the two sides of the inner surface of the micro-channel structure, the bottom plate and the cover plate form a closed cavity in a welding mode, and the micro-channel vapor chamber with the concave cavity structures is formed through vacuumizing liquid injection. The micro-channel array with the concave cavity structure is adopted to replace a conventional condensation end liquid suction core structure, so that transmission and uniform distribution of a working medium are facilitated, the condensation area of the working medium is increased, a condensation backflow path is shortened, and lower flow resistance and excellent dryout resistance are achieved; and the concave cavity structure can increase the heat transfer area, can generate a jet throttling effect, can disturb steam flow, can inhibit formation of a condensate film, can promote condensation reflux and can increase the anti-dryout limit, so that the heat transfer efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of microelectronic devices and chips, in particular to a microchannel soaking plate with a cavity structure. Background technique [0002] With the miniaturization, integration and functional complexity of electronic equipment, the heating power of electronic chips is getting higher and higher. At present, the surface average heat flux density of electronic chips has exceeded 100W / cm 2 , and has a continuous increasing trend. At the same time, high heat flux will form "hot spots" on the surface of electronic devices, resulting in a decrease in the performance and reliability of electronic chips. [0003] The vapor chamber is a heat dissipation component that transfers heat through phase change. It can quickly transfer and diffuse the heat flow gathered on the surface of electronic components to the condensation surface for heat dissipation, thereby effectively reducing the surface heat ...

AI Technical Summary

Problems solved by technology

[0005] However, the structure of the current micro-channel liquid-absorbing core is relatively simple, and most of them are straight channel array structures.

Straight channel array structure liquid-absorbing core, the inner surface is smooth and gentle, when the steam is condensed on the inner surface of the channel, it is easy to form a layer of liquid film on the surface, which hinders the direct contact between the steam and the condensing plate, which leads to the transmission of the micro-channel condensing plate Thermal resistance increases, heat transfer capacity decreases

In addition, when the steam is cooled to form liquid droplets on the inner surface of the channel, because the inner surface of the straight channel is flat and subjected to high surface tension, it is not easy to drip and flow back to the evaporation end, thereby reducing the drying limit of the vapor chamber and making the vapor chamber Reduced overall thermal performance

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