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Mass transfer method and system for device array

A transfer method and device technology, applied in the mass transfer method and system field of device arrays, can solve the problems of high maintenance cost, long operation time, complex process, etc., and achieve reduced alignment difficulty, high position accuracy, and low cost Effect

Active Publication Date: 2020-02-25
北科天绘(合肥)激光技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the electronic devices formed on the wafer are stripped from the wafer and picked up one by one, and then aligned to the corresponding circuit boards that accept the electronic devices, the process is more complicated, the supporting equipment is complicated, the operation time is long, and maintenance higher cost
However, if the large-area electronic devices on the wafer are aligned and transferred to the corresponding receiving circuit board, it is easy to cause the problem of inaccurate alignment and affect the yield of the product.

Method used

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  • Mass transfer method and system for device array
  • Mass transfer method and system for device array
  • Mass transfer method and system for device array

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Embodiment Construction

[0038] The implementation process of the technical solution of the present invention is described below in conjunction with specific embodiments, which are not intended to limit the present invention.

[0039] Such as Figure 1A Shown is a schematic diagram of the cross-sectional structure of the wafer along the line AA'. Figure 1B A schematic diagram of the wafer structure.

[0040] The wafer 100 can use a 6-inch wafer, and the size of the wafer is not limited. The wafer 100 includes a substrate 10 and a plurality of electronic devices 20 , and the substrate 10 is a carrier substrate for growing the electronic devices 20 . The substrate 10 is, for example, a sapphire substrate, a gallium nitride substrate, an aluminum nitride substrate, a silicon substrate, a gallium arsenide substrate, and a silicon carbide substrate, and the present invention is not limited to the type of the substrate.

[0041] The electronic devices are arranged in an array on a surface of the substrat...

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PUM

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Abstract

The invention discloses a mass transfer method and system of a device array. The method comprises the steps that step 1, a wafer is provided, the wafer comprises a bearing substrate and a plurality ofelectronic devices, the plurality of electronic devices are arranged on one surface of the bearing substrate in an array mode, and each electronic device and a part of the bearing substrate bearing the electronic device form a device unit; step 2, the wafer is cut along the side edges of the device units, each device unit is still connected with at least one adjacent device unit, and all the device units are not separated from the wafer; step 3, the wafer is transferred; and step 4, the transferred wafer is cut again along the side edges of the device units so that the adjacent device units are enabled to be completely separated.

Description

technical field [0001] The invention relates to a method for transferring electronic devices, in particular to a method and system for mass transfer of device arrays. Background technique [0002] In recent years, various electronic devices have tended to be miniaturized and massive. Taking photoelectric conversion diodes or light-emitting diodes as examples, in actual use, display panels usually have millions of light-emitting diodes as pixels, and laser In radar LiDAR equipment, a large number of photoelectric conversion diodes are also used as signal receiving components. [0003] Due to the small size of electronic devices, precise alignment is a problem. If the electronic devices formed on the wafer are stripped from the wafer and picked up one by one, and then aligned to the corresponding circuit boards that accept the electronic devices, the process is more complicated, the supporting equipment is complicated, the operation time is long, and maintenance higher cost....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68327H01L2221/68354
Inventor 张珂殊张智武张悦
Owner 北科天绘(合肥)激光技术有限公司