Copper-aluminum composite radiator and machining method thereof

A technology of copper-aluminum composite and processing method, which is applied in the direction of heat exchanger shell, indirect heat exchanger, heat exchange equipment, etc., can solve problems such as inability to ensure sufficient contact surface, inability to completely eliminate air bubbles, inability to meet heat dissipation requirements, etc., to achieve Easy processing, faster heat transfer and low cost

Pending Publication Date: 2020-02-28
浙江天毅半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of material, the current aluminum alloy radiator can not meet the increasing heat dissipation requirements
The aluminum alloy radiator cannot be directly welded to the DBC board, and must be bonded by an intermediate medium (thermal silicone grease) and then fixed by bolts. However, the thermal conductivity of the intermediate medium (thermal silicone grease) is poor, air bubbles cannot be completely eliminated, and contact cannot be guaranteed. Sufficient surface affects heat conduction efficiency

Method used

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  • Copper-aluminum composite radiator and machining method thereof
  • Copper-aluminum composite radiator and machining method thereof
  • Copper-aluminum composite radiator and machining method thereof

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Embodiment Construction

[0024] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, an embodiment of the copper-aluminum composite radiator of the present invention includes an aluminum alloy radiator main body 1, and also includes a copper substrate 2 embedded in the heat conducting surface of the aluminum alloy radiator main body and in the shape of a slot. The slot above the copper base plate 2 is open, and capillary plates 4 are laid in the slot. The capillary plates 4 are interlaced honeycomb in cross section, and the heat transfer is rapid and uniform. The slot opening is closed by the DBC board 3 through welding to form a module. In order to form a vapor chamber structure inside the copper substrate, liquid is also vacuumed and injected into the slot. Use the evaporation of liquid to absorb heat and condense to release heat to further accelerate heat transfer and further strengthen and improve the heat dissipation effect. The bottom of the copper substrate 2 has a mortise and ten...

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PUM

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Abstract

The invention discloses a copper-aluminum composite radiator. The radiator comprises an aluminum alloy radiator body and further comprises a copper substrate fixed to a heat conduction surface of thealuminum alloy radiator body in an embedded mode and in a clamping groove shape. An opening is formed in the upper portion of a clamping groove of the copper substrate. A capillary plate is paved in the clamping groove. The opening of the clamping groove is closed by soldering a DBC plate. The composite radiator fully utilizes characteristics of two types of materials, namely, the characteristicsthat the copper is quick in heat conductivity while the aluminum is high in heat sinking capability, easy to machine, low in cost and the like; by means of the better heat conductivity of the copper,heat transfer is quickened, and the heat sinking performance is improved; the capillary plate is arranged inside the copper substrate, namely the clamping groove, and can transfer heat more quickly; and the copper substrate and the DBC substrate can be directly welded in the opening of the groove, the integrated radiator is formed directly, the number of subsequent procedures is decreased, and nointermediate medium heat-conducting silicone grease is needed.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a radiator for power devices. Background technique [0002] As the power of power devices continues to increase, the requirements for heat sinks are getting higher and higher. Generally speaking, increasing the heat dissipation area can increase the heat dissipation effect of the heat sink, but at the same time, it also increases the volume and cost of the heat sink, and does not conform to the development trend of overall device miniaturization. In terms of material, the current aluminum alloy radiator cannot meet the increasing heat dissipation requirements. The aluminum alloy radiator cannot be directly welded to the DBC board, and must be bonded by an intermediate medium (thermal silicone grease) and then fixed by bolts. However, the thermal conductivity of the intermediate medium (thermal silicone grease) is poor, air bubbles cannot be completely eliminated, and contact c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04F28F9/18F28F21/08
CPCF28D15/046F28F9/18F28F21/084F28F21/085
Inventor 邱珍华邱嘉龙刘亚坤
Owner 浙江天毅半导体科技有限公司
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