Photosensitive resin composition

A technology of photosensitive resin and composition, applied in the direction of optics, optomechanical equipment, instruments, etc., can solve the problems of not being able to give excellent line shape, no coating film development, etc., achieve excellent line shape and clarity, and prevent halo , the effect of increasing the sensitivity

Pending Publication Date: 2020-03-10
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if, for example, a small diameter (such as left and right) through-holes and blind vias, there is a problem that the coating film applied on the through-holes and blind vias may not be developed in the process of developing the coating film after the exposure process.
In addition, since halos are generated in the coating film, undercuts (under-cut) sometimes occur in the lines of the cured coating film, resulting in the problem that excellent line shapes cannot be imparted.

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～5

[0072] The components shown in the following Table 1 were mixed in the compounding ratio shown in the following Table 1, and mixed and dispersed at room temperature (25° C.) using a triple roll to prepare Examples 1 to 6 and Comparative Examples 1 to 5. The photosensitive resin composition used in. Unless otherwise specified, the compounding quantity of each component shown in following Table 1 shows a mass part. In addition, the blank part of the compounding quantity in Table 1 shows that it was not compounded.

[0073] 【Table 1】

[0074]

[0075] In addition, the details about each component in Table 1 are as follows.

[0076] (A) Photosensitive resin containing carboxyl group

[0077] ・KAYARAD ZAR-2000: Nippon Kayaku Co., Ltd. (solid content 65% by mass, diethylene glycol monoethyl ether acetate 25% by mass, solvent naphtha 10% by mass)

[0078] (B) Photopolymerization initiator

[0079] NCI-831: (9-ethyl-6-nitro-9H-carbazol-3-yl)(4-((1-methoxypropan-2-yl)oxy)-2-met...

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Abstract

Provided is a photosensitive resin composition which is capable of imparting excellent linear shape and clarity to a cured coating film by preventing halo during exposure, and which is capable of reliably developing a coating film on a blind guide hole even on a through-hole having a small diameter. The photosensitive resin composition includes (A) a carboxyl group-containing photosensitive resin,(B) a photopolymerization initiator, (C) an epoxy compound, (D) a colorant, and (E) a photoreaction stabilizer.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for a covering material, for example, a covering material for protecting a conductive circuit pattern formed on a substrate such as a printed wiring board, and a photocured product obtained by photocuring the photosensitive resin composition , Wiring boards, such as a printed wiring board obtained by coating with the photocured film of this photosensitive resin composition. Background technique [0002] When forming a solder resist film on a printed wiring board, after forming a coating film of a photosensitive resin composition on a printed wiring board, a photomask is placed on the coating film, and the printed circuit board is printed by using active energy rays such as ultraviolet rays. The exposure process is performed by one exposure method of exposing the entire surface of the wire plate. In the exposure step, in order to increase the sensitivity of the photosensitive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027H05K1/02
CPCG03F7/027H05K1/02
Inventor 石坂将畅今井伸治斋藤隆英
Owner TAMURA KK
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