An electronic product casing processing method and electronic product casing

Abstract

The invention discloses a processing method for an electronic product casing, which is applied in the field of electronic equipment, and comprises the following steps: using ceramics as a raw material, through steps such as grinding, polishing, laser treatment, corona treatment, glue coating and laminating, etc., to obtain Electronic product housing; the invention offsets the asymmetric stress generated during the polishing process of the ceramic inner surface through the introduction of laser treatment, and achieves the effect of flatness correction; at the same time, the surface energy of the ceramic material is increased through ultraviolet laser technology, The bonding strength of the colloid to the ceramic is improved; the invention can clean the spilled material in the process of AFP (Anti Finger Print, anti-fingerprint treatment), avoiding the risk of contaminated products flowing into the assembly object; the invention replaces the traditional Therefore, there is no introduction of baking varnish paint and grinding liquid in the present invention, the production process is environmentally friendly, and the cost advantage is obvious.

Description

technical field [0001] The invention discloses a processing method for an electronic product casing and an electronic product casing produced by the processing method. Background technique [0002] With the increasing application of electronic products such as smart phones, a large number of researchers are also focusing on the research of housing materials for electronic products. A variety of mobile phone flagship models have launched mobile phone products made of ceramic materials, especially 2.5D ceramic mobile phones. The back shell, because the ceramic material has a warm and jade-like touch, high strength, high hardness and excellent scratch resistance, and has little impact on the performance of the antenna, it has become an important choice for the development of mobile phone back shell materials in the future. However, due to the limitations of the current post-processing process of ceramics, there are always two major problems in the application of ceramics that r...

AI Technical Summary

Problems solved by technology

However, due to the limitations of the current post-processing process of ceramics, there are always two major problems in the application of ceramics that restrict product development costs and application performance: one is the poor flatness of ceramics during the polishing process, which restricts the overall process yield; the other is Insufficient bonding strength during the assembly process affects the bonding performance of the ceramic back shell and the metal middle frame

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