Device for testing high-temperature thermal conductivity of low-thermal-conductivity material
A testing device and a thermal conductivity technology, which are applied in the field of high-temperature thermal conductivity testing devices for low thermal conductivity materials, can solve the problems of poor temperature uniformity, poor high-temperature thermal conductivity testing accuracy, and difficulty in achieving one-dimensional steady-state heat flow. Improves accuracy, compensates for heat dissipation, improves temperature uniformity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0100] This embodiment provides a high-temperature thermal conductivity testing device for low-thermal-conductivity materials, wherein the heating plate adopts a square wrap-around configuration (the first configuration) made of NiCr alloy, with a thickness of 2.5mm, see Figure 7 to Figure 8 .
[0101] This kind of heating plate is used to test the hot surface temperature of the sample, and the test results can be found in Figure 9 ,From Figure 9 It can be seen that the hot surface of the sample can reach more than 1000°C, and the temperature uniformity is good, and the temperature uniformity deviation is ±5.3%.
Embodiment 2
[0103] This embodiment provides a high-temperature thermal conductivity testing device for low thermal conductivity materials, wherein the heating plate adopts a spiral configuration (the second configuration) made of Rh, see Figure 10 to Figure 11 .
[0104] In order to further prove that the temperature-uniform high-temperature heating plate provided by this application can withstand high temperatures above 1400°C, pure Rh wire can be used as the heating plate, and C / SiC can be used as the uniform temperature plate. The heating power and the size parameters of the heating element are calculated when the temperature of the hot surface reaches 1400°C.
[0105] Table 1 Heat transfer calculation results of 1400℃ heating unit
[0106]
[0107]
[0108] From the calculation results in Table 1, it can be seen that if a Rh wire with a diameter of 0.8mm is used as a heating element under theoretical conditions, a Rh wire with a length of about 7.4m is required to be coiled on...
Embodiment 3
[0111] This embodiment provides a high-temperature thermal conductivity testing device for low-thermal-conductivity materials, wherein the heating plate adopts a multi-parallel slat configuration (the third configuration) made of graphite, see Figure 12 .
[0112] Using graphite as the heating plate and C / SiC as the uniform temperature plate, the ANSYS simulation analysis of the heating unit’s temperature rise and temperature uniformity was carried out. 7 pieces; the gap width is 11-12-12-12-12-11mm in sequence, a total of 6 pieces, and the size of the plate array is 300mm×300mm, which is the same as that of the vapor chamber and the sample. In the simulation model, the heating plate is made of high-purity graphite, and its thermal conductivity at room temperature is 108W / m·K, and the sample uses a certain heat-insulating tile material.
[0113] For temperature distribution on the lower surface of the vapor chamber, see Figure 13 shown. From Figure 13 It can be seen tha...
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


