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Device for testing high-temperature thermal conductivity of low-thermal-conductivity material

A testing device and a thermal conductivity technology, which are applied in the field of high-temperature thermal conductivity testing devices for low thermal conductivity materials, can solve the problems of poor temperature uniformity, poor high-temperature thermal conductivity testing accuracy, and difficulty in achieving one-dimensional steady-state heat flow. Improves accuracy, compensates for heat dissipation, improves temperature uniformity

Active Publication Date: 2020-03-24
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above analysis, this application aims to provide a high-temperature thermal conductivity testing device for low thermal conductivity materials to solve the problem of poor temperature uniformity and difficulty in achieving one-dimensional steady-state heat flow in the high-temperature thermal conductivity testing device in the prior art. Requirements lead to poor accuracy of high temperature thermal conductivity test

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  • Device for testing high-temperature thermal conductivity of low-thermal-conductivity material
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  • Device for testing high-temperature thermal conductivity of low-thermal-conductivity material

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Embodiment 1

[0100] This embodiment provides a high-temperature thermal conductivity testing device for low-thermal-conductivity materials, wherein the heating plate adopts a square wrap-around configuration (the first configuration) made of NiCr alloy, with a thickness of 2.5mm, see Figure 7 to Figure 8 .

[0101] This kind of heating plate is used to test the hot surface temperature of the sample, and the test results can be found in Figure 9 ,From Figure 9 It can be seen that the hot surface of the sample can reach more than 1000°C, and the temperature uniformity is good, and the temperature uniformity deviation is ±5.3%.

Embodiment 2

[0103] This embodiment provides a high-temperature thermal conductivity testing device for low thermal conductivity materials, wherein the heating plate adopts a spiral configuration (the second configuration) made of Rh, see Figure 10 to Figure 11 .

[0104] In order to further prove that the temperature-uniform high-temperature heating plate provided by this application can withstand high temperatures above 1400°C, pure Rh wire can be used as the heating plate, and C / SiC can be used as the uniform temperature plate. The heating power and the size parameters of the heating element are calculated when the temperature of the hot surface reaches 1400°C.

[0105] Table 1 Heat transfer calculation results of 1400℃ heating unit

[0106]

[0107]

[0108] From the calculation results in Table 1, it can be seen that if a Rh wire with a diameter of 0.8mm is used as a heating element under theoretical conditions, a Rh wire with a length of about 7.4m is required to be coiled on...

Embodiment 3

[0111] This embodiment provides a high-temperature thermal conductivity testing device for low-thermal-conductivity materials, wherein the heating plate adopts a multi-parallel slat configuration (the third configuration) made of graphite, see Figure 12 .

[0112] Using graphite as the heating plate and C / SiC as the uniform temperature plate, the ANSYS simulation analysis of the heating unit’s temperature rise and temperature uniformity was carried out. 7 pieces; the gap width is 11-12-12-12-12-11mm in sequence, a total of 6 pieces, and the size of the plate array is 300mm×300mm, which is the same as that of the vapor chamber and the sample. In the simulation model, the heating plate is made of high-purity graphite, and its thermal conductivity at room temperature is 108W / m·K, and the sample uses a certain heat-insulating tile material.

[0113] For temperature distribution on the lower surface of the vapor chamber, see Figure 13 shown. From Figure 13 It can be seen tha...

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Abstract

The invention discloses a device for testing the high-temperature thermal conductivity of a low-thermal-conductivity material, belongs to the technical field of thermal conductivity testing equipment,and aims to solve the problems that in the prior art, a high-temperature thermal conductivity testing device is relatively poor in temperature uniformity and relatively poor in high-temperature thermal conductivity testing accuracy due to the fact that the requirement of one-dimensional steady-state heat flow is difficult to meet. The device comprises a vacuum unit, a heating unit, an in-situ thickness measuring unit and a signal collecting and processing unit. The vacuum unit is used for providing a testing environment with adjustable and controllable gas pressure and atmosphere for the heating unit. The in-situ thickness measuring unit is used for measuring the thickness of a sample in real time in situ, and the signal collecting and processing unit is used for calculating collected data to obtain heat conductivity. The high-temperature assembly comprises a temperature equalizing plate, a heating plate and a heat insulation layer which are sequentially stacked. The heating temperature of the heating plate is gradually increased along the direction gradually away from the center of the heating plate. The testing device can be used for testing the high-temperature heat conductivity of the low-heat-conductivity material.

Description

technical field [0001] The present application relates to a thermal conductivity testing device, in particular to a high temperature thermal conductivity testing device for low thermal conductivity materials. Background technique [0002] The thermal conductivity test technology is based on the one-dimensional steady-state Fourier heat transfer law. A sample with a certain width-thickness ratio is placed between the heating unit and the cooling device. When the temperature of the hot surface of the sample and the cold surface of the sample When it is uniform and constant at a certain temperature difference, under ideal conditions, a quasi-one-dimensional longitudinal steady-state heat flow will be established inside (especially the central area). The thermal conductivity of the sample can be obtained from the thickness of the sample. [0003] The heating unit is the main body of the entire thermal conductivity test system. The temperature and temperature uniformity that the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 高增华王阳周金帅吴宪何小瓦原涛彭广瑞张昊裴雨辰
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH