Preparation method of waterproof power supply based on prime coating process

Abstract

The invention discloses a preparation method of a waterproof power supply based on a prime coating process, and the preparation method of the waterproof power supply based on the prime coating processcomprises the following steps: assembling: assembling each functional component, a circuit board and a power supply shell which are prepared in advance; testing, namely testing the assembled functional components, the circuit board and the power supply shell; spraying, namely spraying the surfaces of the tested functional components and the circuit board and the inner side of the power supply shell; airing: placing the sprayed functional components, the circuit board and the power supply shell on a ventilated operation line, and naturally airing the functional components, the circuit board and the power supply shell; and pouring glue, namely quantitatively pouring glue into the aired product by using a glue pouring machine. The method has the beneficial effects that the primer adopted bythe solvent-free primer belongs to a solvent-free primer, so that the harm to the environment is reduced, the problem of potential safety hazards is also reduced, and meanwhile, no harm is brought tothe health of workers.

Description

technical field [0001] The present invention relates to the field of preparation of a waterproof power supply with a primer coating process, and in particular, relates to a method for preparing a waterproof power supply based on a primer coating process. Background technique [0002] With the rapid development of society, a large amount of energy resources are consumed, and the greenhouse effect causes climate deterioration. In response to the national requirements for energy conservation and emission reduction and other green and environmental protection, LED power supplies gradually occupy a dominant position in the market due to their high efficiency, long life, small size, and light weight, which meet the needs of the times. At the same time, the market's waterproof requirements for power supplies are gradually increasing. Improve the service life of the power supply, and manufacturers need to develop automation in production, improve production efficiency, save energy a...

AI Technical Summary

Problems solved by technology

[0005] (1) Condensation-type potting compound is composed of hydroxyl-terminated polysiloxane combined with alkoxy cross-linking agent, adhesive and catalyst, which is prone to reversion degradation in a high-temperature sealing environment, resulting in reversion near heating components. The original liquid or gel form will lose the physical sealing and waterproof effect, and the power supply will fail;

[0006] (2) The mixing ratio of A / B components is strictly required, and the production control requirements are very high. It is easy to cause the glue not to dry, and the curing speed is strongly correlated with the seasonal temperature, and the quality control is relatively complicated;

[0007] (3) The polarity of this type of glue itself is strong, which may cause negative corrosion effects on sensitive parts;

[0008] (4) Small molecules are released during the curing process of this type of condensation-type encapsulant, which will form a large shrinkage stress and cause abnormalities such as strain on sensitive components, resulting in abnormal power output performance

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