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Process for producing paper-in-resin electronics and application in manufactured products

A technology of electronic devices and electronic components, applied in the direction of electronic equipment, chemical instruments and methods, paper/cardboard layered products, etc., can solve the problem of increasing the overall process cost, lack of adhesion or even separation of polymer composites or sandwiches, Production waste and other issues to achieve the effect of excellent oxygen and moisture barrier function

Inactive Publication Date: 2020-03-24
AW品牌有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But these technical operations can be complex, time-consuming, lead to production waste, and ultimately add significantly to the overall process cost
In addition, polymers tend to have different coefficients of thermal expansion, which leads to a lack of adhesion or even separation of polymer composites or cores upon cooling after the production of plastic parts

Method used

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  • Process for producing paper-in-resin electronics and application in manufactured products
  • Process for producing paper-in-resin electronics and application in manufactured products
  • Process for producing paper-in-resin electronics and application in manufactured products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] Example 1: Photovoltaic Application

[0122] Using paper in photovoltaic applications would be considered very challenging for a number of reasons:

[0123] - Photovoltaic (PV) materials, especially organic printable materials, tend to be very sensitive to oxygen and water. Therefore, an excellent barrier is required.

[0124] -Most PV applications are exterior applications and it may be considered incompatible for paper use due to moisture sensitivity.

[0125] However, a suitable photovoltaic device ( figure 1 ), the device uses paper as a substrate with electrodes, PV layers and printed back electrodes embedded in a sandwich impregnated and encapsulated with resin. The arranged layers (ie transparent conductive layer, PV layer, printed layer forming the back electrode) are provided on a support paper sheet which is applied to the kraft paper. Transparent or translucent sheets obtained after impregnating Powercoat XD paper with resin can also be added to functiona...

Embodiment 2

[0134] Example 2: Emissive Display Application

[0135] Using paper in display applications would be considered very challenging for a number of reasons:

[0136] -Display materials, especially organic printable materials, tend to be very sensitive to water and oxygen. Therefore, an excellent barrier is required.

[0137] -Most display applications are mobile, hand-held and require rugged and robust solutions due to their fragility,

[0138] They may be considered incompatible with the scheme of the paper.

[0139] Using various characteristic paper sheets, a display can be conceived ( figure 2 ), which uses paper as a substrate, with the top transparent electrode, the display stack (which can be a light-emitting LED or OLED stack), and the printed back electrode embedded in a sandwich impregnated and encapsulated with resin. The arranged layers are provided on a support paper sheet which is applied to the kraft paper. Alternatively, transparent conductive layers can b...

Embodiment 3

[0148] Example 3: Energy Harvesting Applications

[0149] Using paper in energy harvesting applications would be considered very challenging for a number of reasons:

[0150] - Piezoelectric (Piezo) materials, especially organic printable materials, tend to be very sensitive to water. Therefore, an excellent barrier is required.

[0151] - Most energy harvesting applications are ground or outdoor applications, which may be considered incompatible for paper use due to moisture sensitivity, robustness requirements, scratch resistance, etc.

[0152] Using various characteristic paper sheets, a display can be conceived ( image 3 ), the display uses paper as the substrate, and the top decorative paper, printed electrodes, piezoelectric layer and printed back electrode are embedded in a sandwich impregnated and encapsulated with resin. The arranged layers are provided on a support paper sheet which is applied on kraft paper. Transparent or translucent sheets obtained after re...

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Abstract

The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers, as well as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process, as said device sustains high pressure, high temperature, does not create bubbles, does not delaminate, and can be fully embedded into an end product.

Description

technical field [0001] The present invention relates to "Paper in Resin electronic devices" and thus provides a paper-based printed electronic device impregnated and encapsulated with resin, the electronic device being a monolithic structure, in particular a flat or Curved monolithic structures. In particular, (in particular flat or curved) monolithic structures can be obtained by performing a lamination process. In this way, paper-based printed electronic devices (hereinafter simply referred to as electronic devices for convenience) can be integrated or embedded into products or objects, for example by performing a lamination process, while providing a monolithic structure. Thus, the present invention relates to the preparation of electronic devices that may be involved in the Internet of Things, wherein the electronic devices are embedded in different materials (paper, wood, glass, plastic...). Background technique [0002] Printed electronics enables electronically func...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03D21H27/00B32B21/06
CPCD21H27/00H05K1/0386D21H19/36B32B2260/028B32B2260/046B32B2307/7265B32B29/005B32B2250/03B32B2255/12B32B2255/205B32B2255/28B32B1/00B32B2307/7244B32B2457/08B32B2307/7246B32B2307/75B32B2307/546B32B2250/26B32B2457/00B32B2457/12B32B2457/206B32B2255/26B32B21/06B42D15/00H05K1/092H05K2201/0284
Inventor G·德普雷斯J-M·沃
Owner AW品牌有限公司