Wafer tray processing method
A processing method and pallet technology, applied in the field of mechanical processing, can solve problems such as easy deformation of aluminum alloy sheets, difficulty in meeting technical requirements for flatness and parallelism, and achieve the effect of overcoming easy deformation
Active Publication Date: 2020-03-27
宁波江丰芯创科技有限公司
View PDF7 Cites 3 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The problem solved by the invention is: in the processing process, the aluminum alloy sheet to be processed is easily deformed, and the flatness and parallelism are difficult to meet the technical requirements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] It can be seen from the background technology that Al6061 aluminum alloy is an excellent raw material for LED wafer trays, but the thickness of the aluminum alloy used in the processing process is very small, and it is very easy to deform.
[0026] The analysis found that in the process of processing the aluminum alloy sheet, the existing processing technology uses ordinary fixtures to fix and clamp the aluminum alloy sheet, and then when the aluminum alloy sheet is processed, the aluminum alloy sheet cannot be guaranteed during the processing process. flatness and parallelism.
[0027] In order to solve the above problems, the present invention provides a method for processing a wafer tray. First, a blank to be processed is provided, and the blank is put into a numerically controlled machine tool. processing; then, take out the finished blank from the CNC machine tool, put it into a finishing milling center, fix the blank with a milling fixture, perform finish milling,...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| depth | aaaaa | aaaaa |
Login to View More
Abstract
The invention relates to a wafer tray processing method, which comprises the following steps of: putting a blank into a numerical control machine tool, fixing the blank by adopting a full-circle clamp, and ensuring the planeness of the blank subjected to subsequent finish machining by arranging a special full-circle clamp, taking out the blank subjected to finish machining from the numerical control machine tool, putting the blank into a finish milling machining center, fixing the blank by adopting a hole milling clamp, and performing finish milling machining to mill out details of a wafer tray so as to form a primary wafer tray, polishing the primary wafer tray to guarantee the smoothness of a plane, and finally, carrying out anodic oxidation on a partial region of the polished primary wafer tray to improve the wear resistance of the wafer tray. In the machining process, a corresponding clamp is correspondingly arranged for each step of machining, so that the planeness and the parallelism of the machined wafer tray are guaranteed.
Description
technical field [0001] The invention relates to the field of mechanical processing, in particular to a method for processing a wafer tray. Background technique [0002] In the semiconductor processing technology, the wafer is usually fixedly placed on the wafer tray during the coating process. LED is a solid-state semiconductor device, and the LED wafer tray is required in the manufacturing process. Al6061 is a kind of Al-Mg-Si aluminum alloy. This alloy has strong corrosion resistance and has excellent welding characteristics and electroplating properties. Therefore, using Al6061 aluminum alloy as the raw material for processing the wafer tray has become the demand of customers. [0003] The surface flatness of the LED wafer tray must meet the technical requirements of no more than 0.05mm, and the parallelism of the two planes must meet the technical requirements of no more than 0.2mm. If the flatness or parallelism does not meet the technical requirements, it is easy to t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 姚力军潘杰王学泽占卫君
Owner 宁波江丰芯创科技有限公司