Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cooling device based on R245fa refrigerant

A cooling device and refrigerant technology, applied in the direction of refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve the problems of unable to meet the heat dissipation requirements of electronic equipment, and achieve the effects of safe use, adjustable heat dissipation temperature, and high heat dissipation heat flux density

Pending Publication Date: 2020-04-10
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the heat dissipation of electronic equipment is solved by air cooling or water cooling. However, with the improvement of the performance of electronic equipment and the miniaturization of size, the heat dissipation of electronic equipment is showing higher and higher heat flux density. Traditional air cooling or water cooling The method has gradually been unable to meet the heat dissipation requirements of electronic equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling device based on R245fa refrigerant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail:

[0025] This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, components are exaggerated for clarity.

[0026] A cooling device based on R245fa refrigerant, including a circulating pump, a first heat exchanger, a base plate, a second heat exchanger and a fan;

[0027] The output end of the circulation pump, the first heat exchanger, and the input end of the second heat exchanger are connected in sequence through pipelines, and the output end of the second heat exchanger is connected with the input end of the circulation pump through pipelines to form circulation loop;

[0028] R245fa r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cooling device based on an R245fa refrigerant. The cooling device comprises a circulating pump, a first heat exchanger, a base plate, a second heat exchanger and a fan. The output end of the circulating pump, the first heat exchanger and the input end of the second heat exchanger are sequentially connected through pipelines, and the output end of the second heat exchangeris connected with the input end of the circulating pump through a pipeline to form a circulating loop. The R245fa refrigerant is arranged in the circulation loop, one side of the substrate is fixedlyconnected with the first heat exchanger, the other side of the substrate makes contact with a device needing to be cooled, and the fan is used for cooling the second heat exchanger. The refrigerant R245fa is utilized, so that the cooling device is non-toxic, harmless, energy-saving, environment-friendly and flame-retardant and is safe to use. Moreover, the device is simple in structure, is easy to assemble and easy to operate, can be used for solving the heat dissipation problem of the common or special chips and other electronic devices, and has the characteristics of high heat dissipation flow density and adjustable heat dissipation temperature.

Description

technical field [0001] The invention relates to the field of refrigerant two-phase heat transfer, in particular to a cooling device based on R245fa refrigerant. Background technique [0002] In recent years, more and more high-tech products are completed with the assistance of electronic equipment. However, whether it is an electronic device on an airplane or a chip in a data center, its safe and efficient operation requires the device itself to work in a reasonable temperature range. [0003] At present, most of the heat dissipation of electronic equipment is solved by air cooling or water cooling. However, with the improvement of the performance of electronic equipment and the miniaturization of size, the heat dissipation of electronic equipment is showing higher and higher heat flux density. Traditional air cooling or water cooling The method has gradually been unable to meet the heat dissipation requirements of electronic equipment. The two-phase heat exchange technolo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20F25B45/00
CPCH05K7/20381F25B45/00
Inventor 罗祖分李晓欢方贤德
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com