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Metal copper micro-channel heat sink with comb-tooth-type structure and manufacturing method

A manufacturing method and microchannel technology, applied in cooling/ventilation/heating transformation, electrical equipment structural parts, electrical components, etc., can solve the problem of SU-8 photoresist difficult to remove flow resistance, etc., to achieve convenient removal, solve hard-to-remove effects

Active Publication Date: 2020-04-14
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problem that the SU-8 photoresist is difficult to remove and the flow resistance is large during the production process of the metal copper microchannel heat sink, the present invention proposes a metal copper microchannel heat sink with a comb-tooth structure and a manufacturing method, namely Fabricate microchannel structures on two metal copper substrates, align and package the two substrates through the grooves and protrusions respectively set on the substrates to form metal copper microchannels with a comb-tooth structure, and the microchannels on each substrate The width is wide, which is convenient for the removal of SU-8 glue, and the micro-channel of the comb structure is beneficial to reduce the flow resistance to the cooling medium

Method used

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  • Metal copper micro-channel heat sink with comb-tooth-type structure and manufacturing method
  • Metal copper micro-channel heat sink with comb-tooth-type structure and manufacturing method
  • Metal copper micro-channel heat sink with comb-tooth-type structure and manufacturing method

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Embodiment Construction

[0029] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] Such as figure 1 , as shown in 2, the base plate 1 is made of copper, which is made into a cuboid substrate of 6cm×6cm×0.5cm by wire cutting process. Through standard processes such as substrate grinding, polishing, coating, photoresist exposure, and development, the film is patterned and the conductive substrate is exposed. On the base plate 1 with SU-8 photoresist microstructure, the micro-electroforming of copper is carried out, and the groove structure 3 and the base plate microchannel structure 4 are processed. The groove width of the groove structure 3 is 1.75 mm, and the height is 0.5 mm. mm, the bottom plate microchannel structure 4 is composed of 100 bottom plate microwalls 9, each bottom plate microwall 9 is 2 cm long, 100 μm wide, and 500 μm high, and the distance between adjacent bottom plate microwalls 9 is 400 μm. Use SU...

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Abstract

The invention discloses a metal copper micro-channel heat sink with a comb-tooth-type structure and a manufacturing method, and belongs to the technical field of micro-manufacturing. The method is characterized in that micro-channel structures are manufactured on two metal copper substrates correspondingly, grooves and protruding structures correspondingly arranged on the substrates are aligned with each other, and the two substrates are packaged, so that a metal copper micro-channel with the comb-tooth-type structure is formed; and the width of the micro-channels on the substrates are large so that SU-8 glue can be conveniently removed, and the micro-channel with the comb-tooth-type structure is beneficial to reducing the flow resistance to cooling media. The heat sink and the method solve the problems that due to the characteristics of small line width and large depth-to-width ratio of an existing metal copper micro-channel heat sink manufactured based on the UV-LIGA technology, on one hand, the SU-8 glue is difficult to remove after the electroforming process is completed; and on the other hand, the flow resistance of the small-line width metal copper micro-channel heat sink islarge.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and relates to a metal copper micro-channel heat sink with a comb-tooth structure and a manufacturing method. Background technique [0002] At present, metal copper microchannels are mainly fabricated by UV-LIGA, micromachining, micro-EDM, and micro-electrolytic machining. The width of metal copper microchannels fabricated by micro-machining, micro-EDM and micro-electrolytic machining is usually more than 200 μm. The UV-LIGA process based on SU-8 photolithography and micro-electroforming technology has unique advantages in ensuring the patterning accuracy and structural quality of the microchannel, so the UV-LIGA process is often used for small line width and large aspect ratio. , Fabrication of metal copper microchannels with small surface roughness and high verticality of side walls. [0003] The metal copper microchannel fabricated by UV-LIGA process has the characteristics of sm...

Claims

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Application Information

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IPC IPC(8): B23P15/00H05K7/20
CPCB23P15/00H05K7/20336
Inventor 杜立群白志鹏翟科曹强张希王舒萱温义奎
Owner DALIAN UNIV OF TECH
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