High-frequency copper-clad plate and preparation method thereof

Abstract

The invention relates to a high-frequency copper-clad plate and a preparation method thereof, and aims to solve the problems of complex process and material pollution in the existing high-frequency copper-clad plate production process. The high-frequency copper-clad plate comprises gummed copper foils and prepregs, and the gummed copper foils and prepregs are sequentially and alternately stacked.The preparation method of the high-frequency copper-clad plate comprises the following steps; a steel plate, a bearing disc, an upper buffer pad and a lower buffer padare cleaned; the lower buffer padis placed in the middle of the bearing disc, and then the steel plate is placed on the lower buffer pad; the gummed copper foilwith the rough surface facing upwards is placed in the center of the steel plate and laid flatly; the prepregs and the glued copper foils are alternately laminated in sequence according to the set laminating number, then the upper buffer pads are placed in the centers ofthe prepregs and the glued copper foils, and steel covers cover the prepregs and the glued copper foils; a pressing program of a hot press is set; the materials are fed into the hot press; and the hotpressis started, and processing is performed to obtain the high-frequency copper-clad plate finished product by the hot press through vacuum, heating and hydraulic processes according to set parameters.

Description

technical field [0001] The invention belongs to the technical field of high-frequency copper-clad laminates, and in particular relates to a high-frequency copper-clad laminate and a preparation method thereof. Background technique [0002] With the increasing market demand for high-frequency copper-clad laminates and the continuous updating and development of its product technology, high-frequency copper-clad laminates have become mainstream products in the high-end market, and high-frequency copper foil and high-frequency composite adhesives are the key to its forming Raw materials, the production of high-frequency copper-clad laminates usually uses glass cloth adhesive sheets, which are laminated by adhesive film and copper foil and pressed together at high temperature. The production of this process adhesive film is to coat the composite adhesive on the PET release film. , the PET film is difficult to degrade, which has caused great harm to the environment; the current hi...

AI Technical Summary

Problems solved by technology

[0003] The first object of the present invention is to provide a high-frequency copper-clad laminate to solve the problems of complex process and material pollution in the production process of the existing high-frequency copper-clad laminate

Images